Ceramic Packaging Enclosure

Ceramic packaging is the “case” that uses ceramic materials (like alumina, aluminum nitride, or beryllium oxide) as the housing or substrate for integrated circuits. It’s a protective enclosure or base that prevents the semiconductor chip from environmental damage and provides electrical connections to the outside world.

Material Properties

Property		Value	92F	93D
Color	–	–	黑色	白色
Al2O3 Content	–	%	92	93
Density	25℃	g/cm3	3.7	3.65
Thermal Conductivity	25℃	W/(m· K)	20	18
Coefficient of Linear Thermal Expansion	40℃~400℃	x10-6/℃	6.7	7
	40℃~800℃		6.9	7.2
Volume Resistance	20℃	Ω·cm	1014	1014
	300℃		1010	1010
	500℃		108	109
Dielectric Constant	1MHZ	–	10	9
Dielectric Loss	1MHZ	x10-4	4	4
Flexural Strength	0.5mm/min	MPa	400	400

Ceramic packaging shells come in various structural forms depending on the characteristics and operating environments of different devices.

 

1. Ceramic Small Outline Package (CSOP)

Features:

• Compact size, wing-shaped leads, low stress
• Excellent resistance to mechanical shock
• Multiple lead pitches: 1.27mm, 1.00mm, 0.80mm, etc.

Applications:

• IC packaging
• High-reliability component packaging for space, radiation, or military/defense applications

 

2. Surface-Mount Device package (SMD)

Features

• High electrical conductivity and current-carrying capacity
• Large-area heat sink for the chip bonding zone
• Reliable performance and excellent thermal dissipation

Applications:

• Microwave device housing
• Crystal oscillator housing

 

3. Ceramic Dual-in-Line Package (CDIP)

Features

• Dual in-line package
• Wide range of pin counts
• EMI/RFI Protection

Applications:

• Programmable Logic Device, LSI
• Optocouplers, MEMS devices, etc.

 

4. Ceramic Leadless Chip Carrier/Ceramic Quad Flat Non-leaded Package (CLCC/CQFN)

Features

• Low parasitic parameters and compact size
• Excellent heat dissipation and high reliability
• Available in dual-sided and quad-sided lead configurations
• Multiple lead pitches: 1.27mm, 1.00mm, 0.50mm, etc.

Applications:

• Suitable for high-density surface mounting
• VLSI, ASIC, and ECL circuits

 

5. Laser SMD package

Features

• High thermal conductivity, superior crystal protection
• Stable performance and driving power
• Compact surface-mount device 7mm combined with built-in safety
• Enables ultra-long projection distances, narrow beam angles, and compact optical sizes

Applications:

• Portable Search and Rescue Lighting
• Automotive and Construction Lighting
• Outdoor and entertainment Lighting

 

6. Laser SMD packa

Features

• High airtightness and reliability
• Meets speed requirements from 10 GHz to 400 GHz in various applications
• Customizable development available

Applications:

• Fiber optic communications
• Optoelectronic transmitters and receivers
• Optical switches and modules, High-power lasers

Innovacera offers one-stop ceramic packaging solutions, ranging from standard parts to fully customized designs. For ceramic package housings, please feel free to contact us.