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Showing posts from June, 2023

Three pieces small doses ceramic rotary valve piston metering pump

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INNOVACERA® Three-pieces small doses ceramic rotary valve piston metering pump Similar Series Products Min Filling Volume: 0.2ml Similar Series Products Max Filling Volume: 50ml Filling accuracy : <=0.5% Package way: plastic box with soft sponge and then put in paper carton N.W: G.W.: Package box size: Innovacera ceramic metering pump is widely used for many famous brand filing machine. We can make customized shape and size of ceramic filling pump according to clients design request. Product size for reference: High Precision Filling Three Piece Ceramic Piston Metering Pump used in filling machine photos: Product Application: Applicable in quantitative subpackage with high level of hygienerequirement like injection oral liquid etc. Widely applied to pharmaceutical equipments of famous enterprises BOSCH, B+S, IMA, GROENINGER, INOVA company and Trucking Technology, Miaxis, Qianshan etc. CERAMIC FILLING PUMP FEATURES: Liquid non-polluting, High precision Long service life, Very high
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  Ultra High Precision Ceramic Ring Gauges Ceramic Setting Ring Innovacera developed a series of ceramic accessories for Inside Micrometers, Holtest and Dial Bore Gages. The ceramic material used mostly is zirconia. The zirconia ceramic setting ring advantages: High wear resistance and long service life The coefficient of thermal expansion is very small, the effect of temperature is very small The hardness is very high, there is no need to worry about surface scars. Ring gauge management is simple (regular inspection interval is long, saving cost). The Zirconia Ceramic Ring Gauges Technology: Surface Roughness: Not more than Ra0.1um Straight Angle: 0.05/φ100 Parallelism: Not more than0.015mm Each 0.5mm as one size, from 1mm to 50mm. Size Dimensional interval Roundness Outer diameter tolerance: Inner diameter tolerance Hardness 1-29mm 0.5mm 0.5um ±1um ±1um 1200HV 30-50mm 0.5mm 0.8um ±1.6um ±1.5um 1200HV   Some Zirconia Ceramic Ring Gauges Innovacera made and size detail: 9mm, 10mm, 18m

Aluminum Nitride Ceramic Substrate

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Aluminum nitride ceramic substrates have excellent thermal conductivity (7-10 times of alumina ceramics),low dielectric constant and dielectric loss, reliable insulation performance, excellent mechanical properties, non-toxic,high temperature resistance, chemical corrosion resistance, and the thermal expansion coefficient of silicon is similar, as a new generation of ceramic materials, more and more by people Attention and attention. Aluminum nitride substrate produced by our company lead the quality of similar domestic products, with the international advanced level, widely used in communication devices, high brightness LED, power electronic devices and other industries. Substrate thickness: 0.25mm, 0.385mm, 0.5mm, 0.635mm, 0.8mm, 1mm, 1.5mm, 2mm, 3mm AlN Substrate Application: Often used in electrical and electronic fields requiring heat conduction, heat dissipation, insulation, high temperature resistance,high voltage breakdown resistance, high thermal conductivity, good stabilit

Boron nitride ceramic components - Tube / ring / crucible / nozzle / pla...

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Hexagonal Boron Nitride has a microstructure similar to that of Graphite. In both materials this structure, made up of layers of tiny platelets, is responsible for excellent machinability and low-friction properties. we called hexagonal boron nitride (HBN) or white graphite. Material of Boron Nitride Ceramics: Pyrolytic Boron Nitride: 99.99% Boron Nitride 99 Boron Nitride: Boron Nitride + Boric Oxide (B2O3) CABN: Boron Nitride + Calcium Borate ALBN: Boron Nitride + Al2BO3 ZRBN: Boron Nitride + Zirconium Oxide + Boric Oxide (B2O3) ZABN: Boron Nitride + Zirconium Oxide + Aluminum Nitride + Al2BO3 SCBN: Boron Nitride + Silicon Carbon + Al2BO3 Applications of Boron Nitrides Ceramics: Thermal Management Excellent electrical insulation and thermal conductivity make BN very useful as a heat sink in high-power electronic applications. Its properties compare favorably with beryllium oxide, aluminum oxide, and other electronic packaging materials, and are easier machinable to desired shapes and