Butterfly Ceramic Package for Optoelectronic Modules
The Butterfly Ceramic Package is a housing for optoelectronic modules, which provides a fiber feed-through, built-in thermal management, and electrical fan-out for photonic integrated circuits (PICs). This package has robust quality and high reliability. The design is flexible and customized, and Innovacera developed standardized production processes suitable for high-volume manufacturing The butterfly package employs a high-temperature ceramic (HTCC) design, which effectively improves pin density and air density reliability, and meets the miniaturization requirements of the packaged module. These high-reliability packages incorporate alumina ceramic or aluminum nitride brazed with Cu-cored alloy pins/leads and a metal heat spreader at the bottom. And the surface coating of the package can be adjusted according to the characteristics of the user’s micro-assembly process to meet the requirements and different atmospheric conditions. The Roles of a Package – Dissipates heat g...