What is Ceramic Packaging? A Guide to Hermetic Protection for Semiconductors.
Ceramic packaging is the “housing” for sealing and protecting semiconductor chips, MEMS, or other electronic components. This effectively protects Integrated circuit packaging (ICs), sensors, and other electronic devices from external environmental influences such as moisture, dust, and temperature fluctuations. As semiconductor technology advances towards higher power, smaller size, and higher frequency. A ceramic package consists of a multilayer ceramic substrate, metal paste and a metal lid, which is made of High-Temperature Co-Fired Ceramic (HTCC) process. The core strength of this method lies in leveraging the superior physical properties inherent to ceramic materials. The ceramic materials are alumina (Al2O3) or aluminum nitride (AlN), possess excellent thermal conductivity, high electrical insulation, and superior mechanical strength. Our ceramic hermetic packages deliver consistently high performance in leakage rates lower than 5×10⁻⁸ atm·cc/s range. And bra...