Why Is Boron Nitride Ceramic Used as a Preferred Sintering Fixture Material for Aluminum Nitride and Silicon Nitride Substrates?
Against the backdrop of the rapid development of new energy vehicles, 5G communication, power semiconductors and the third-generation semiconductor industry, the market demand for high-performance electronic packaging ceramic materials continues to rise. Aluminum nitride (AlN) and silicon nitride (Si₃N₄) ceramic substrates , with their comprehensive advantages of high thermal conductivity, high insulation, and strong structural reliability, have become the core basic carriers for IGBT modules, SiC power devices, vehicle electronic control systems, and high-end precision electronic equipment. The quality of the finished products of high-performance nitride substrates not only depends on the powder formula, molding process and sintering curve, but also the supporting fixtures during the sintering process are a key link determining the flatness, surface quality and batch yield of the substrates. During the high-temperature sintering process, thin substrate bodies are prone t...