CSOP: Hermetic Ceramic Package for Stable and Reliable SMT Applications
In semiconductor equipment, industrial control systems, and high-reliability electronic systems, the package not only provides electrical connections but also directly affects the long-term stability of the device in high-temperature, vacuum, or otherwise demanding environments. Although traditional plastic-encapsulated SOP packaging is cost-effective and fast to produce, it is susceptible to aging, leakage, or performance degradation under high humidity, high temperature, and long-term operation conditions. In contrast, ceramic packaging has inherent advantages in terms of air tightness, material stability, and service life. Among them, Ceramic Small Outline Package (CSOP) is a type of ceramic package that combines mature manufacturing techniques with surface mount requirements. It integrates the high stability of ceramic materials with the compact form factor of SOP (Surface Mount Package), and is widely used in electronic systems that have high requirements for reliabilit...