INNOVACERA | technical ceramic solutions

The Butterfly Ceramic Package is a housing for optoelectronic modules, which provides a fiber feed-through, built-in thermal management, and electrical fan-out for photonic integrated circuits (PICs). This package has robust quality and high reliability. The design is flexible and customized, and Innovacera developed standardized production processes suitable for high-volume manufacturing  The butterfly package employs a high-temperature ceramic (HTCC) design, which effectively improves pin density and air density reliability, and meets the miniaturization requirements of the packaged module. These high-reliability packages incorporate alumina ceramic or aluminum nitride brazed with Cu-cored alloy pins/leads and a metal heat spreader at the bottom. And the surface coating of the package can be adjusted according to the characteristics of the user’s micro-assembly process to meet the requirements and different atmospheric conditions.   The Roles of a Package – Dissipates heat g...

Are you looking for a ceramic can be used for high temperature more than 1500 degree centigrade, or even more 2000 degree C? In Innovacera, we have such a material that can meet your requirement. It is MSZ zirconia ceramic.We also call it yellow Zirconia as its appearance is yellow color.   Its main composition is zirconium oxide about 95%, second is MgO around 2%. With MgO joining in, its performance is totally different with common Zirconia ceramic, which is white color without porosity and is only suitable for working temperature below 1000 degree C.    We have two types of the yellow Zirconia, one with high density 5.3-5.5g/cm3 but low porosity ≤5%.，one with lower density 4.8-5.2g/cm3 but higher porosity ≤12%. Please note that the density and porosity is a range not an exact data as different technology it will be different. It can be doing by casting, dry pressing and Isostatic pressing. Different technology the cost is various.   Here is the material data sheet...

In high vacuum and ultra-high vacuum systems, the electrical connections or functional components crossing the vacuum boundary are always the key factors affecting the stability and lifespan of the system. Traditional organic seals or mechanical compression structures often encounter risks of aging, gas release and sealing failure under high temperature, thermal cycling and long-term operation conditions.  In response to this industry challenge, we have introduced the  Ceramic Vacuum Feedthrough , manufactured using a mature high-temperature vacuum brazing process. Through the mature high-temperature vacuum brazing process, it achieves a permanent airtight connection between ceramics and metals, specifically designed for the demanding vacuum pressure environment.   Structural Design Based on Engineering Requirements This component uses high-purity alumina ceramic as the insulating core, combined with metal materials (such as stainless steel, molybdenum or Kovar alloy) who...

As the developing of the power electronics, manufacturers are looking for substrate solutions that not only deliver reliable performance but also make sense from a cost and production method. Alumina (Al₂O₃) substrates used in Direct Plated Copper (DPC) technology remain a practical and widely adopted choice across many industries.   A Reliable and Cost-Effective Material Choice   Alumina substrates have been used in electronic package for a long time due to reliable electrical insulation, strong mechanical support, and steady thermal performance, which making them a good choice for a wide range of power and electronic applications used every day.   Alumina has a great advantage for cost-effectiveness when compared with other ceramic materials. Manufacturers can reach to dependable performance without driving up overall system costs, with a well-established supply chain, stable quality, and the ability to support mass production. As a result, alumina DPC substrates are pa...