The manufacturing process of high thermal conductivity ceramic substrates
The ceramic substrates used for high-power devices are mostly planar. The manufacturing process of planar ceramic substrates can be divided into two steps: forming and sintering. The common forming processes and their characteristics in the reports are shown in Table 2. Among them, dry pressing and tape casting are widely used in the industrial production of ceramic substrates. The process flow of dry pressing is shown in Figure 2a, and the pressure application and holding time are the most important parameters in the dry pressing process. Tape casting is considered to be an economical, continuous and automated process for manufacturing large-sized planar ceramic substrates, and its process is shown in Figure 2b. Tape casting has the characteristics of low cost and high efficiency in preparing multi-layer materials and devices, and is widely used in the manufacture of such items as low-temperature co-fired ceramic substrates, capacitors and microwave dielectric ceramic dev...
