Why AlN Ceramic Substrates Are Used in Optical Modules
With the rapid development of AI computing power, cloud computing, and data center networks, optical communication systems are continuously evolving toward higher bandwidth. As data transmission rates increase from 400G to 800G and up to 1.6T, power density is also rising significantly. Under these circumstances, thermal management within optical modules has gradually become one of the key factors affecting performance stability and long-term reliability. Due to its excellent thermal conductivity and electrical insulation properties, aluminum nitride (AlN) ceramic substrates are emerging as a critical material choice for high-speed optical module packaging. 01 Industry Insight: High-Speed Optical Modules Are Driving the Upgrade of Packaging Materials In recent years, AI data centers and high-speed communication networks have continued to expand, pushing optical modules rapidly from 100G/200G toward 400G, 800G, and even 1.6T. As data rates increase, internal integrat...