INNOVACERA | technical ceramic solutions

Participate in the Semicon Southeast Asia 2026 in Kuala Lumpur to explore the application trends of boron nitride, micro   porous ceramics   and alumina substrates, aluminum nitride substrates in power devices, electronic packaging and precision processing, and seize the innovation opportunities in the Asia-Pacific semiconductor industry.   About the Semicon Southeast Asia 2026   In 2026, Semicon Southeast Asia 2026 will witness its annual grand event – the Semiconductor Exhibition at the Kuala Lumpur International Convention Centre.This exhibition brings together the world’s leading suppliers to showcase the latest applications and technical cases of boron nitride, micro porous ceramics, alumina substrates, aluminum nitride substrates and precision machined parts.Next, we will comprehensively introduce the exhibition bright spot, key material trends and application cases, helping enterprises and engineers understand the latest developments of advanced semicondu...

  At present, consumer electronic products are always striving for high integration in packaging technology and lightweighting of the products. Although plastic packaging can become the mainstream solution due to its cost and technical advantages, in the field of high-end and high-reliability applications, ceramic packaging plays an irreplaceable role. The dual in-line package (DIP) form, which emerged in the middle of the last century, is a very classic structure. Along with the development of ceramicization,   ceramic dual in-line package (DIP) enclosure   have become an important carrier for key components in systems with strict long-term reliability requirements.   The through-hole dual-row lead design of the ceramic dual-in-line package (CDIP) features a mature and stable assembly process. The encapsulation tube shell is usually composed of a high-purity alumina or aluminum nitride ceramic substrate, a metallized wiring layer, and an airtight welding structure, ...