INNOVACERA | technical ceramic solutions

Insert Way: When the insulation tube is used, the two poles of a temperature measuring element are inserted into different holes in the same direction. The temperature measuring element is sleeved in a protection tube to be protected after being arranged. Stock size of insulation tube: outer diameter 1mm to 12mm, with single orifice, double, four or more orifices in diameter 0.5mm minimal, maximal length 1600mm, all dimensions can be customized according to user demands. Technical parameters: Maximum service temperature: 1800℃ Compressive strength:2500 Mpa Volume density: 3.95g/cm3 Bending strength :400Mpa Fracture toughness:5-7 Mohs hardness: 9 Application: The insulation tube is made from a material with good insulation property, and is mainly used for separating different polarity items of a temperature measuring element, so that the phenomenon that the two poles interfere with each other or are in contact with each other to cause a short circuit is avoided, and temperature is acc

Direct Bonded Copper Ceramic Substrates DBC ceramic substrate, short for Direct Bonded Copper Ceramic substrate, is an advanced material  composed of a ceramic substrate (typically Al2O3 or AlN) and copper, tightly joined together  through a hypo-eutectic process. This unique combination of materials results in a substrate with  exceptional thermal conductivity, low thermal expansion, high strength, and excellent wettability for  soldering applications. Direct Bonded Copper Ceramic Substrates Material Property – Low Thermal Expansion – High Strength – High Thermal Conductivity – High Wettability for Solder Direct Bonded Copper Ceramic Substrates Applied Area – Power Electronics: IGBT, MOSFET, Thyristor Module, Solid-state Relay, Diode, Power Transistors – Automotive: ABS, Power Steering, DC/DC Converter, LED Lighting, Ignition Control – Home Appliance: Air Conditioner, Peltier Cooler – Environmental Technology: Local Power Generation, Electric Vehicle, Traction Control System, Photovol

BAB259 Ceramic cavity reflectors work particularly well in Ruby and Nd:YAG laser pumping chambers and can be a highly cost effective alternative to metal coated reflectors. They are also used extensively as reflectors in housings for high intensity lamps. - Resist chemical attack - high strength - high reflectivity over a broad wavelength band - good thermal conductivity and electrical stability at all operating temperatures. Physical Characteristics: - Color: White - Density: 3.1Mg/m^3 - Porosity: 22% - Flexural strength: 170Mpa - Coefficient of thermal expansion: 7.9×10^-6--/С (200～500℃) 9×10^-6/С (200～1000℃)

The range of Innovcera porous ceramic filters is made from aluminum oxide and silicon carbide. The strong, uniform porous ceramic has 40-50% open porosity with a tortuous pore structure and is available in pore sizes ranging from 1 to 100 microns. Maximum Temperature Up to 1000C for porous ceramic, limited only by sealants, gaskets and/or hardware materials. Corrosion Resistance Porous ceramics are resistant to most acids, except for Hydrofluoric Acid and Phosphoric Acid. In alkaline solutions, porous ceramics are resistant up to pH9. It is also resistant to organic solvents. The sealants, gaskets and/or hardware materials used, may be the limiting factor in certain fluids. Cleanability Porous ceramic is cleanable by a variety of methods, depending on the type of contaminant to be removed. Methods include spraying, brushing, backwashing, oven firing, dilute acid cleaning, solvent cleaning, steam cleaning and ultrasonic cleaning. Porous ceramics are used for: Ceramic Vacuum Chucks Cera

Hot pressed aluminum nitride ceramic is used in applications requiring high electrical resistivity in addition to exceptional thermal conductivity. The applications for hot-pressed AlN typically involve rigorous or abrasive environments and high-temperature thermal cycling. Thermal Conductivity：80-100 W/M.K Typical Applications: 1.Semiconductor heaters 2.Ballistics armor

Aluminum Nitride Aluminium nitride is a high performance material particularly suited to demanding electrical applications. Typical aluminium nitride characteristics include: 1.Very good thermal conductivity 2.Thermal expansion coefficient similar to that of silicon 3.Good dielectric properties 4.Good corrosion resistance 5.Stability in semiconductor processing atmospheres Typical aluminium nitride applications include: 1.Heat sinks 2.Electronic substrates 3.IC packages 4.Power transistor bases 5.Microwave device packages

Introduction to ceramic reflector The material of the ceramic reflector is  99% Al2O3 . Its green body is fired at a suitable temperature to retain the proper porosity and strength. The surface of the ceramic reflector is coated with a high reflectivity ceramic glaze, so compared with the gold-plated reflector, it has long service life and diffuse reflection. Production Process Preparation of the green body Preparation of glaze slurry: raw material weighing – grinding – screening Glazing: glazing by spraying Glaze burning: the glazed product is burning at a high temperature Inspection: Appearance inspection, dimensional measurement, and reflectance measurement Packaging Prime Features Surfaces can be sealed and coated with a solarization-resistant glaze to give high bulk reflectivity 97% reflectance efficiency at 600-1000nm Reflectance efficiency exceeds 95% across the wavelength range 400-1200nm (see curve) Controlled porosity Good thermal conductivity High electrical resistivity Prec

Hot pressing  Aluminum Nitride (AlN) ceramics   are used as wafer heating plates and wafer holding electrostatic chucks in semiconductor fabrication equipments. Advantages of Hot pressing ALN Aluminum nitride ceramic: – High purity – Electrical insulator – High thermal conductivity – Critical thermal management material – Reduced Particulate Generation – Corrosion/Erosion Resistance – Controlled Electrical Properties Properties: Property Units Value Flexural Strength, MOR (20 °C) MPa 300-460 Fracture Toughness MPa m1/2 2.75-6.0 Thermal Conductivity (20 °C) W/m K 100-170 Coefficient of Thermal Expansion 1 x 10-6/°C 3.3-5.5 Maximum Use Temperature °C 800 Dielectric Strength (6.35mm) ac-kV/mm 16.0-19.7 Dielectric Loss 1MHz, 25 °C 1 x 10 -4  to 5 x 10 -4 Volume Resistivity (25°C) Ω-cm 10 13  to 10 14 Typical Application: – Cover plates and MRI equipment(Magnetic Resonance Imaging) – High-power detectors, plasma generators, military radios – Electrostatic chucks and heating plates for semic

  The dicing  vacuum chuck table can be made more than 12 inches, according to customer requirements with different shape like the disc, square and irregular shape. The size of thinning vacuum chuck can be matched with 3 inch wire, 4 inch wire, 5 inch wire, 6 inch wire, 8 inch wire and 12 inch wire. It can also be customized according to requirement. They are widely used for Disco, ADT, K&S, Applied materials, TSK, OKAMOTO, Micro Automation as special tools for adsorption and carrying. The main feature includes: High flatness and parallelism Good permeability and uniform adsorption High strength Long life time Easy to process

Innovacera have more than 7 years experience in producing  porous ceramic  part for vacuum chuck, filters, air bearings for semiconductor and pharmaceutical industry. The range of Innovacera porous ceramic filters is made from aluminum oxide and silicon carbide. The strong, uniform porous ceramic has 40-50% open porosity with a tortuous pore structure and is available in pore sizes ranging from 1 to 100 microns. Monolithic, single grade, aluminum oxide porous ceramic is available in 6, 15, 30, 50, 60, and 100 microns pore sizes. The porous ceramic disc processing is not the same as other ceramics, such as alumina ceramic, zirconia ceramics because of its properties of pores, so when you process the porous ceramics disc, here are 4 points you need to pay attention to: Put the porous ceramic plate into the water for five minutes. Ensure the porous plate be full of water to avoid oil contamination permeate into pores. Cut the plate with the blade only, and then grind it with a grinding wh

  Semiconductor Wafer Carrier Alumina Disk and Ceramic Edge Ring High precision ceramic components  improve yield management for semiconductor wafer processing.   Innovacera ceramic components  provide precise dimensional stability, ultra-flatness and smoothness, and vacuum holding of wafers during inspection and processing. Low-surface-contact configurations minimize risk of back-side particles negatively affecting wafer geometry for precision applications. The main features of high precision ceramic parts: 1. Wear and abrasion resistance: Alumina is a tough technical ceramic with very good wear resistance. 2. High precision dimensions with tightening tolerance, it easier to get a perfect fitting relationship. 3. Chemical inertness, resistant to most of the strong acids and alkalis. 4. High-temperature ability: withstand up to 1600°C in oxidizing and reducing atmospheres. 5. Great mechanical properties, hardness, compressive, and flexural strength are much higher in stainless steel. 6

  Boron Nitride Nozzles for Molten Metal Atomizing Boron Nitride nozzles  are widely used in the processing of metal powder. Molten metal atomization is a process used to fabricate metal powder from a melt. In a typical atomizer, liquid metal is poured from a nozzle into a large chamber while being sprayed with high-pressure water, oil or gas. This causes the metal droplets to separate and condense into a powder that collects at the bottom. Atomization has become one of the most popular methods of powdering metals. Atomization begins in a furnace where the metal is kept liquefied by electric heating elements. The metal falls into the spray chamber through a “nozzle” – this nozzle is designed to a high degree of perfection and specification. The nozzle is one of the most important parts of the atomization process – a damaged or clogged nozzle can cause the metal flow to stop or the flow to increase dramatically – both of which can disrupt the powdering process. To prevent this from happ

The most commonly used forming processes in the   advanced ceramics industry  are cold isostatic pressing, injection molding, hot isostatic pressing and dry pressing. As an advanced ceramics manufacturer, we’d like to introduce the cold isostatic pressing process. CIP is a method of compacting powdered materials into a solid homogeneous mass before machining or sintering. It can produce high-integrity billets or preforms that exhibit little distortion or cracking when fired. Its advantages and features include: Improve production efficiency:  CIP is easy to operate, the process is stable and can be mass-produced, so the production efficiency is high. Optimizing material properties:  CIP can make the powder material form a dense green body under high pressure, which has a high density, usually reaching more than 95% of the theoretical density. This makes the ceramic material produced by cold isostatic pressing have higher strength, hardness and wear resistance. Fine grains:  In the proc