Butterfly Ceramic Package for Optoelectronic Modules

The Butterfly Ceramic Package is a housing for optoelectronic modules, which provides a fiber feed-through, built-in thermal management, and electrical fan-out for photonic integrated circuits (PICs). This package has robust quality and high reliability. The design is flexible and customized, and Innovacera developed standardized production processes suitable for high-volume manufacturing 

The butterfly package employs a high-temperature ceramic (HTCC) design, which effectively improves pin density and air density reliability, and meets the miniaturization requirements of the packaged module. These high-reliability packages incorporate alumina ceramic or aluminum nitride brazed with Cu-cored alloy pins/leads and a metal heat spreader at the bottom. And the surface coating of the package can be adjusted according to the characteristics of the user’s micro-assembly process to meet the requirements and different atmospheric conditions.

 

The Roles of a Package
– Dissipates heat generated by IC chips.
– Protects IC chip(s) from environmental influence, including moisture, dust, light, and electromagnetic interference.
– Protects the IC chip mechanically.
– Provides input/output signals and required isolation.

 

 

Key features
– Hermeticity : 5×10-8 atm·cc/s
– Finish: Ni/Au plating for solder & wire bonding
– PICs of various sizes and several material platforms are supported
– Insulation performance: Volume resistivity > 10¹⁴Ω·cm (25℃)
– Integrated thermoelectric cooler (TEC) and thermistor for thermal control

 

Innovacera is committed to continuously refining its materials and assembly processes, striving to provide stronger assurance for chip applications across diverse industries. Looking forward contact our photonic packaging engineering team today to discuss your application-specific requirements.