INNOVACERA | technical ceramic solutions

Innovacera’s  Aluminum Nitride (AlN)  Substrates deliver exceptional thermal conductivity, a thermal expansion coefficient closely matched to silicon, and excellent electrical insulation, making them an ideal choice for high-power electronic applications. With superior mechanical strength, high breakdown voltage, and outstanding thermal shock resistance, AlN substrates ensure reliable performance in demanding environments. Their precision machining capability and customizable specifications make them well-suited for IGBT power modules, high-power LEDs, and advanced heat dissipation components.   Features • High thermal conductivity • Thermal expansion coefficient close to silicon wafer • High breakdown voltage Application • High power IGBT power module • High-power LED • High power heat sink Material Properties Table P roject Test conditions Unit AlN AN-170 AN-200 AN-230 Material – – AlN AlN AlN Appearance – – Light blue beige beige Surface roughness Ra μ m 0.2~0.75 0.2~0...

Ceramic packaging  is the “case” that uses ceramic materials (like alumina, aluminum nitride, or beryllium oxide) as the housing or substrate for integrated circuits. It’s a protective enclosure or base that prevents the semiconductor chip from environmental damage and provides electrical connections to the outside world. Material Properties Property Value 92F 93D Color – – 黑色 白色 Al 2 O 3  Content – % 92 93 Density 25℃ g/cm 3 3.7 3.65 Thermal Conductivity 25℃ W/(m· K) 20 18 Coefficient of Linear Thermal Expansion 40℃~400℃ x10 -6 /℃ 6.7 7 40℃~800℃ 6.9 7.2 Volume Resistance 20℃ Ω ·cm 10 14 10 14 300℃ 10 10 10 10 500℃ 10 8 10 9 Dielectric Constant 1MHZ – 10 9 Dielectric Loss 1MHZ x10 -4 4 4 Flexural Strength 0.5mm/min MPa 400 400 Ceramic packaging shells come in various structural forms depending on the characteristics and operating environments of different devices.   1. Ceramic Small Outline Package (CSOP) Features: Compact size, wing-shaped leads, low stress Excellent res...