INNOVACERA | technical ceramic solutions

  Innovacera will attend Productronica 2025, the world’s leading trade fair for electronic development and production, from November 18–21, 2025, at the Trade Fair Center Messe München. We invite you to visit us at Booth B2 Hall 1409 to explore how our technical ceramic solutions address critical challenges in electronic manufacturing, from high-density packaging to thermal management and precision assembly. Ceramic Packages: The Gateway to Advanced Electronic Manufacturing Productronica 2025 brings together the global electronics industry, featuring innovations in PCB, semiconductor, and assembly technologies. As electronic devices evolve toward miniaturization and higher power densities, traditional materials struggle to meet demands for reliability, thermal performance, and hermeticity. Innovacera’s technical ceramics offer exceptional electrical insulation, high-temperature resistance, and tailored thermal properties, making them ideal for next-generation electronic application...

Ceramic packaging  is the “case” that uses ceramic materials (like alumina, aluminum nitride, or beryllium oxide) as the housing or substrate for integrated circuits. It’s a protective enclosure or base that prevents the semiconductor chip from environmental damage and provides electrical connections to the outside world. Material Properties Property Value 92F 93D Color – – 黑色 白色 Al 2 O 3  Content – % 92 93 Density 25℃ g/cm 3 3.7 3.65 Thermal Conductivity 25℃ W/(m· K) 20 18 Coefficient of Linear Thermal Expansion 40℃~400℃ x10 -6 /℃ 6.7 7 40℃~800℃ 6.9 7.2 Volume Resistance 20℃ Ω ·cm 10 14 10 14 300℃ 10 10 10 10 500℃ 10 8 10 9 Dielectric Constant 1MHZ – 10 9 Dielectric Loss 1MHZ x10 -4 4 4 Flexural Strength 0.5mm/min MPa 400 400 Ceramic packaging shells come in various structural forms depending on the characteristics and operating environments of different devices.   1. Ceramic Small Outline Package (CSOP) Features: Compact size, wing-shaped leads, low stress Excellent res...

  Innovacera develops ceramic packages and metal packaging shells to meet customer customized requirements. Innovacera’s factory has established robust capabilities in the research and development of ceramic and glass materials, tape casting for green ceramics, microwave/RF simulation, packaging technologies including the ceramic packaging shells/substrates, brazing/sealing, and surface treatment processes, offering customers comprehensive and integrated packaging solutions.     Innovacera offers ceramic packages for semiconductor discrete device power electronics by using ceramic-to-metal sealing technologies. Ceramic packages adopt a ceramic sidewall structure instead of the traditional bead-type insulated ceramic design, significantly improving the voltage withstand performance of the housing. Copper-cored kovar lead pins and WCu heat sinks are bonded onto multilayer alumina ceramic packages or aluminium nitride ceramic packages. It is primarily used for encapsulating ...

Innovacera develops ceramic packages and metal packaging shells to meet customer customized requirements. Innovacera’s factory has established robust capabilities in the research and development of ceramic and glass materials, tape casting for green ceramics, microwave/RF simulation, packaging technologies including the ceramic packaging shells/substrates, brazing/sealing, and surface treatment processes, offering customers comprehensive and integrated packaging solutions.   Innovacera offers ceramic packages for semiconductor discrete device power electronics by using ceramic-to-metal sealing technologies. Ceramic packages adopt a ceramic sidewall structure instead of the traditional bead-type insulated ceramic design, significantly improving the voltage withstand performance of the housing. Copper-cored kovar lead pins and WCu heat sinks are bonded onto multilayer alumina ceramic packages or aluminium nitride ceramic packages. It is primarily used for encapsulating high-power tra...