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Porous ceramic chuck table used in semiconductor equipment

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  Porous ceramic chuck table  is a so important part in semiconductor equipment such as silicon wafer processing. Porous Ceramic Vacuum Chucks  are widely used as important components of equipment in silicon wafer, semiconductor compound wafer, piezoelectric ceramic, glass, LED, semiconductor package component substrate, optical component thinning, cutting and so on. The advantages include the following: Strong permeability: Uniform air permeability and water permeability to ensure the uniform stress and firm adsorption of the silicon wafer, so that it does not slip during the grinding process. Compact and uniform structure: Due to the dense and uniform  microporous ceramic , the chuck table is not easy to adsorb silicon powder abrasives and is easy to clean. High strength: No deformation during grinding, to ensure that the silicon wafer is uniformly stressed at all points during grinding, and is not easy to edge breakage and debris. Long service life: The surface sh...

Porous Ceramic Disc

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The range of Innovcera porous ceramic filters is made from aluminum oxide and silicon carbide. The strong, uniform porous ceramic has 40-50% open porosity with a tortuous pore structure and is available in pore sizes ranging from 1 to 100 microns. Maximum Temperature Up to 1000C for porous ceramic, limited only by sealants, gaskets and/or hardware materials. Corrosion Resistance Porous ceramics are resistant to most acids, except for Hydrofluoric Acid and Phosphoric Acid. In alkaline solutions, porous ceramics are resistant up to pH9. It is also resistant to organic solvents. The sealants, gaskets and/or hardware materials used, may be the limiting factor in certain fluids. Cleanability Porous ceramic is cleanable by a variety of methods, depending on the type of contaminant to be removed. Methods include spraying, brushing, backwashing, oven firing, dilute acid cleaning, solvent cleaning, steam cleaning and ultrasonic cleaning. Porous ceramics are used for: Ceramic Vacuum Chucks Cera...

Porous Ceramic Dicing and Thinning Vacuum Chuck

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  The dicing  vacuum chuck table can be made more than 12 inches, according to customer requirements with different shape like the disc, square and irregular shape. The size of thinning vacuum chuck can be matched with 3 inch wire, 4 inch wire, 5 inch wire, 6 inch wire, 8 inch wire and 12 inch wire. It can also be customized according to requirement. They are widely used for Disco, ADT, K&S, Applied materials, TSK, OKAMOTO, Micro Automation as special tools for adsorption and carrying. The main feature includes: High flatness and parallelism Good permeability and uniform adsorption High strength Long life time Easy to process

Porous Ceramic Dicing and Thinning Vacuum Chuck

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Source: https://www.innovacera.com/news/porous-ceramic-dicing.html The dicing vacuum chuck table can be made more than 12 inches, according to customer requirements with different shape like the disc, square and irregular shape. The size of thinning vacuum chuck can be matched with 3 inch wire, 4 inch wire, 5 inch wire, 6 inch wire, 8 inch wire and 12 inch wire. It can also be customized according to requirement. They are widely used for Disco, ADT, K&S, Applied materials, TSK, OKAMOTO, Micro Automation as special tools for adsorption and carrying. The main feature includes: High flatness and parallelism Good permeability and uniform adsorption High strength Long life time Easy to process

Porous ceramic chuck table used in semiconductor equipment

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Source: https://www.innovacera.com/news/ceramic-chuck-table.html Porous ceramic chuck table is a so important part in semiconductor equipment such as silicon wafer processing. Porous Ceramic Chuck Tables are widely used as important components of equipment in silicon wafer, semiconductor compound wafer, piezoelectric ceramic, glass, LED, semiconductor package component substrate, optical component thinning, cutting and so on. The advantages include the following: Strong permeability: Uniform air permeability and water permeability to ensure the uniform stress and firm adsorption of the silicon wafer, so that it does not slip during the grinding process. Compact and uniform structure: Due to the dense and uniform microporous ceramic, the chuck table is not easy to adsorb silicon powder abrasives and is easy to clean. High strength: No deformation during grinding, to ensure that the silicon wafer is uniformly stressed at all points during grinding, and is not easy to edge breakag...