PCIM Europe 2026 Preview: Focus on Power Electronics and Advanced Materials Trends

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 Against the backdrop of the rapid development of new energy and high-power electronic applications, high-performance materials are becoming the key to enhancing system efficiency and reliability. PCIM Europe 2026 will be held in Nuremberg, Germany in June 2026, bringing together the latest technologies and innovative achievements in the global power electronics field.

 

Innovacera will participate in the exhibition with a variety of advanced ceramic solutions (booth number: 5-112), highlighting the applications of boron nitride, microporous ceramics, and aluminum oxide and aluminum nitride substrates in power devices, electronic packaging, and precision processing.

Regarding PCIM Europe 2026

PCIM Europe is currently the most influential professional exhibition and communication platform in the global power electronics industry. The exhibition has been dedicated to promoting the innovation and upgrading of power electronic technology in the industrial and practical scenarios. This year’s exhibition brought together equipment manufacturers, material suppliers, system integrators, and research institutions from all over the world. They collectively showcased the latest technological achievements in core fields such as power semiconductors, drive control, energy management systems, and advanced materials. The exhibition covered the entire industrial chain from device research and development, material development to system implementation and application, and also provided a high-quality platform for technical exchanges and cooperation among industry professionals. As an important platform connecting academic research and industrial practical applications, PCIM Europe not only demonstrates the current technical level of power electronics but also focuses on future development directions such as energy transition, electrification systems, and efficient power conversion. It continuously provides support for the innovative development of related industries worldwide.

 

Time and Place: June 9th to 11th, 2026, Nuremberg Exhibition Center, Germany

ItemDetails
Year2026
FormatIn-Person
ScopeInternational exhibition covering the full power electronics value chain
ExhibitorsLeading global companies in power electronics and advanced materials
Focus AreasPower semiconductors, drive technologies, energy systems, thermal management, and advanced materials
Show Hours9:00-17:00
Audience ProfileIndustry experts, manufacturers, research institutions, universities, and media

 

Aluminum Nitride Ceramic Components

 

Main Material Trends and Applications

 

The advantages of boron nitride and its applications in the semiconductor field

 

  • Boron nitride possesses excellent thermal conductivity and electrical insulation properties, and is widely used in semiconductor and power device cooling-related solutions.
  • It plays a significant role in the cooling design of power devices and intelligent packaging.
  • Demonstration cases include: LED heat sink, microelectronic packaging structure.

 

Boron Nitride Insulating Tube

 

Porous ceramics for microelectronic packaging

 

  • Porous ceramic materials possess excellent high-temperature stability and lightweight characteristics, making them suitable for high-density electronic packaging applications.
  • Typical applications include the design of heat dissipation structures in semiconductor modules.

 

Alumina and AlN substrates

 

  • Alumina substrates have the advantages of moderate cost and stable performance, and are suitable for conventional power device applications.
  • AlN substrates, on the other hand, possess higher thermal conductivity and excellent dimensional stability, and are suitable for high-performance power modules and precision packaging fields.
  • The demonstration cases include power modules and precision packaging applications.

 

Aluminum Nitride Substrate

Alumina Substrate

 

Precision processing of ceramic components

 

  • Precision processing of ceramic components enables the manufacturing of complex microstructures, meeting the high precision requirements of semiconductor packaging and optoelectronic devices.
  • In power device heat dissipation modules, microporous ceramics and boron nitride materials are also used in the design of key structures, and relevant application examples are presented.

 

Industry Trends and the Advantages of the German PCIM Platform

 

Currently, the development in fields such as new energy, electric vehicles, energy storage systems, and data centers is continuously driving the upgrade of power electronic technology. It places higher demands on efficiency, power density, and thermal management capabilities, and also leads to an increase in the demand for high-performance materials.

 

Germany has a mature industrial foundation and engineering technology system in the fields of power electronics and high-end manufacturing. Now, centered around Nuremberg, a favorable atmosphere conducive to technological exchanges and industrial cooperation has been formed in the region. PCIM Europe 2026 is an important international exhibition held under such circumstances. It brings together numerous enterprises and industry experts from the global power electronics and advanced materials fields, showcasing various core technologies and application results, and also establishing an efficient platform for technical exchanges and cooperation connections among the upstream and downstream of the industry chain.

 

Ceramic Structural Components

We welcome you to visit and contact us

 

PCIM Europe 2026 is not only a platform for showcasing products, but also an important opportunity to gain a deeper understanding of industry trends and expand cooperation opportunities. Innovacera’s boron nitride, microporous ceramics, alumina and aluminum nitride substrates, as well as various precision processing components, have been widely applied in the markets of Asia, Europe and the United States, covering multiple fields such as power device heat dissipation, microelectronic packaging and the manufacturing of complex and precise structures. The materials showcased at this exhibition represent only a portion of our application cases. If you have any requirements related to high-performance heat dissipation, precise sealing, or customized substrates, please feel free to contact us for technical support. Alternatively, you can visit our booth (5-112) for on-site communication.

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