Boron Nitride Ceramics

Hexagonal Boron Nitride has a microstructure similar to that of Graphite. In both materials this structure, made up of layers of tiny platelets, is responsible for excellent machinability and low-friction properties. we called hexagonal boron nitride (HBN) or white graphite.

Material of Boron Nitride Ceramics

• Pyrolytic Boron Nitride: 99.99% Boron Nitride*
• 99 Boron Nitride: Boron Nitride + Boric Oxide (B2O3)
• CABN: Boron Nitride + Calcium Borate
• ALBN: Boron Nitride + Al2BO3
• ZRBN: Boron Nitride + Zirconium Oxide + Boric Oxide (B2O3)
• ZABN: Boron Nitride + Zirconium Oxide + Aluminum Nitride + Al2BO3
• SCBN: Boron Nitride + Silicon Carbon + Al2BO3

Processing of Boron Nitride Ceramics

• Hot Pressed Sintering
• Chemical Vapor Deposition

Applications of Boron Nitrides Ceramics

• Thermal Management

  Excellent electrical insulation and thermal conductivity make BN very useful as a heat sink in high-power electronic applications. Its properties compare favorably with beryllium oxide, aluminum oxide, and other electronic packaging materials, and are easier machinable to desired shapes and sizes.

• High Temperature Environments

  Temperature stability and excellent resistance to thermal shock make BN the ideal material in the toughest high-temperature environments such as equipment for plasma arc welding, diffusion source wafers, and semiconductor crystal growth equipment & processing.

• Molten Metal Handling

  BN is inorganic, inert, nonreactive with halide salts and reagents, and is not wet by most molten metals and slags. These characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processes.

Comparison of Boron Nitride Ceramics

Properties	Units	BMA	BSC	BMZ	BAN
Main Composition	–	BN+ZR+AL	BN+SIC	BN+ZRO2	BN+ALN
Color	–	White Graphite	Greyish Green	White Graphite	Greyish Green
Density	g/cm3	2.25-2.35	2.4-2.5	2.8-2.9	2.8-2.9
Three-Point Bending Strength	MPa	65	80	90	90
Compressive Strength	MPa	145	175	220	220
Thermal Conductivity	W/m·k	35	45	30	85
Thermal Expansion Coefficient (20-1000℃)	10-6/K	2	2.8	3.5	2.8
Max Using Temperature In Atmosphere In Inactive Gas In High Vacuum (Long Time)	(℃)	900 1750 1750	900 1800 1800	900 1800 1800	900 1750 1750
Room Temperature Electric Resistivity	Ω·cm	>1013	>1012	>1012	>1013
Typical Application	–	Powder Metallurgy	Powder Metallurgy	Metal Casting	Powder Metallurgy
High Temperature Electrical Furnace Components	–	√	√	√	√
Metal Vaporize Crucible	√
The Container of Metal or Glass Melting	–	√	√	√	√
The Casting Mould Components of The Precious Metal and Special Alloy.	–	√	–	–	√
High Temperature Support Part	–	√	–	√	√
Nozzle and Transport Tube of The Melting Metal	–	√	√	√	√
Nitrides Sintering (Sagger and Setter Plate)	–	–	–	–	–

Remark: The value is just for review, different using conditions will have a little difference.