INNOVACERA | technical ceramic solutions

  Against the backdrop of the rapid development of new energy vehicles, 5G communication, power semiconductors and the third-generation semiconductor industry, the market demand for high-performance electronic packaging ceramic materials continues to rise. Aluminum nitride (AlN) and silicon nitride (Si₃N₄) ceramic substrates , with their comprehensive advantages of high thermal conductivity, high insulation, and strong structural reliability, have become the core basic carriers for IGBT modules, SiC power devices, vehicle electronic control systems, and high-end precision electronic equipment.   The quality of the finished products of high-performance nitride substrates not only depends on the powder formula, molding process and sintering curve, but also the supporting fixtures during the sintering process are a key link determining the flatness, surface quality and batch yield of the substrates. During the high-temperature sintering process, thin substrate bodies are prone t...

Hexagonal boron nitride is an excellent self-lubricating ceramic capable of withstanding extremely high temperatures while maintaining its lubricating properties, even in high-vacuum environments. Boron nitride (BN) crucibles are typically manufactured from hot-pressed boron nitride blanks, ensuring high density and structural integrity. Mechanically, hexagonal boron nitride behaves similarly to graphite, but it offers the additional advantage of outstanding electrical insulation.   Compared with graphite crucibles, BN crucibles exhibit significantly lower risk of carbon contamination and demonstrate greater chemical inertness in many high-temperature processes. In comparison with alumina crucibles, BN crucibles show lower wettability to molten metals, making them especially suitable for applications that demand high purity and minimal interaction between the melt and the container. While different crucible materials are optimized for different process conditions, the appropriate s...

  In powder metallurgy (PM) processes, boron nitride and zirconia ceramic nozzles are used depending on the type of metal materials.     Main Features of Ceramic Nozzles   High-temperature resistance: withstands temperatures above 1500  ° C from molten metals or plasma flames.   Wear resistance: resists erosion from powder or gas flow for long-term operation.   Chemical inertness: does not react with active metals or gases.     Applications at Different Stages of Powder Metallurgy Stage Process Functions of Nozzles Ceramic Nozzles Typical Metals Powder Preparation Gas Atomization High-pressure inert gas (such as nitrogen or argon) impinges on the molten metal stream to form fine powder; ceramic nozzles control flow and particle size. Boron Nitride and Zirconia High-purity or reactive metals such as titanium and nickel-based alloys. Water Atomization Ceramic nozzles provide corrosion resistance and precise flow control. Zirconia Used in high-...

  What is Boron Nitride? Hexagonal boron nitride (h-BN) ceramic has a microstructure similar to graphite. It is manufactured by hot pressing boron nitride powders at temperatures up to 2000  ° C and high pressure. The maximum blank size is 500 × 500 × 200 mm, and it can be further machined into complex shapes.   Why Can Boron Nitride Ceramics Be Used in Ion Implanters? Ion implantation is a key process in semiconductor manufacturing, where wafers are doped with foreign atoms to modify material properties such as conductivity and crystal structure.     The high-current extraction electrode is the core of an ion implanter system. It must withstand temperatures up to 1400  ° C, strong electromagnetic fields, aggressive process gases, and high mechanical forces.   Therefore, components made from boron nitride insulator ceramics help ensure that this process remains efficient, precise, and free of impurities.   The unique combination of exceptional the...