Advantages of Aluminum Nitride Ceramics in Wafer Cover Plate Heater Applications

 

In the semiconductor manufacturing process, the aluminum nitride ceramic wafer cover plate is a key component for carrying wafers, and its performance directly affects the quality and processing efficiency of the wafers.

Aluminum nitride ceramics (Aluminum Nitride Ceramic) is a new type of ceramic material with excellent thermal conductivity, electrical insulation, and mechanical properties. Its thermal conductivity can reach 320W/m·K, which is more than 10 times that of alumina ceramics, its electrical insulation can reach more than 10^13Ω·cm, and its bending strength can reach more than 350MPa. These excellent properties make aluminum nitride ceramics have a wide range of application prospects in the field of semiconductor manufacturing.

  

Advantages of aluminum nitride ceramics in wafer cover plate applications

 

1. High thermal conductivity

 

In the semiconductor manufacturing process, wafers need to be processed in a high-temperature environment, such as photolithography, etching, ion implantation, etc. The high thermal conductivity of aluminum nitride ceramics can ensure that the wafer reaches the temperature required by the process in a short time, improving production efficiency; at the same time, high thermal conductivity also helps to uniform the temperature of the wafer, reduce thermal stress, and improve the quality of the wafer.

 

2. Excellent heat dissipation performance

 

During the wafer processing process, some processes will generate a lot of heat, such as laser etching, plasma etching, etc. The excellent heat dissipation performance of aluminum nitride ceramics can quickly transfer heat to the environment, prevent the wafer temperature from being too high, reduce the risk of thermal damage, and improve the quality of wafer processing.

 

3. High electrical insulation

 

During the semiconductor manufacturing process, the surface of the wafer will be coated with conductive materials such as photoresist and anti-reflection layer. The high electrical insulation of aluminum nitride ceramics can effectively prevent the accumulation of charge between the wafer surface and the tray, avoid discharge, and improve the quality of wafer processing.

 

4. Good mechanical properties

 

Aluminum nitride ceramics have high bending strength and hardness, which can ensure that the wafer plate is not easy to wear and crack during transportation and loading and improve the service life of the wafer plate. In addition, the linear expansion coefficient of aluminum nitride ceramics is similar to that of silicon wafers, which is conducive to reducing thermal stress and reducing the risk of wafer warping.

 

5. Corrosion resistance

 

During the semiconductor manufacturing process, the wafer cover plate will be exposed to various chemical reagents, such as photoresist, etching solution, etc. Aluminum nitride ceramics have good corrosion resistance and can resist the erosion of these chemical reagents, ensuring the stability and service life of the wafer plate.

 

6. No pollution

 

Aluminum nitride ceramics have good chemical stability and will not react with the materials on the surface of the wafer, avoiding the generation of impurities and ensuring the quality of wafer processing. At the same time, the production process of aluminum nitride ceramics is more environmentally friendly, which is conducive to reducing the overall carbon emissions of the semiconductor manufacturing industry.

 

 

 

As a wafer cover plate material, aluminum nitride ceramics have the advantages of high thermal conductivity, excellent heat dissipation performance, high electrical insulation, good mechanical properties, corrosion resistance, and no pollution. In the field of semiconductor manufacturing, the application of aluminum nitride ceramic wafer cover plates can improve production efficiency, reduce costs, and improve water quality, which has important practical significance. Innovacera could offer two types of aluminum nitride ceramics, one is aluminum nitride and another is hot pressed aluminum nitride, the main difference is the purity, hot pressed ALN purity is higher than ALN, and thermal conductivity is also different.

 

If you have any questions about the aluminum nitride ceramic, welcome to contact us at sales@innovacera.com.