Advantages of Aluminum Nitride Ceramics in Wafer Cover Plate Heater Applications
In the semiconductor manufacturing process, the aluminum nitride ceramic wafer cover plate is a key component for carrying wafers, and its performance directly affects the quality and processing efficiency of the wafers. Aluminum nitride ceramics (Aluminum Nitride Ceramic) is a new type of ceramic material with excellent thermal conductivity, electrical insulation, and mechanical properties. Its thermal conductivity can reach 320W/m·K, which is more than 10 times that of alumina ceramics, its electrical insulation can reach more than 10^13Ω·cm, and its bending strength can reach more than 350MPa. These excellent properties make aluminum nitride ceramics have a wide range of application prospects in the field of semiconductor manufacturing. Advantages of aluminum nitride ceramics in wafer cover plate applications High thermal conductivity In the semiconductor manufacturing process, wafers need to be processed in a high-temp...