Hot Pressed Aluminum Nitride Ceramic Overview

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Source: https://www.innovacera.com/news/hot-pressed-aluminum-nitride-ceramic-overview.html


Hot Pressed Aluminum Nitride Ceramic

Hot pressed aluminum nitride ceramic is used in applications requiring high electrical resistivity in addition to exceptional thermal conductivity. The applications for hot-pressed AlN typically involve rigorous or abrasive environments and high-temperature thermal cycling.

Below are the properties of the pressed aluminum nitride.

PropertyUnitsValue
Flexural Strength, MOR (20 °C)MPa300-460
Fracture ToughnessMPa m1/22.75-6.0
Thermal Conductivity (20 °C)W/m K80-100
Coefficient of Thermal Expansion1 x 10-6/°C3.3-5.5
Maximum Use Temperature°C800
Dielectric Strength (6.35mm)ac-kV/mm16.0-19.7
Dielectric Loss1MHz, 25 °C1 x 10-4 to 5 x 10-4
Volume Resistivity (25°C)Ω-cm1013 to 1014

The information provided on this chart is for general material property reference only.

Example Applications:

  • Semiconductor heaters

  • Ballistics armor

Should you have any inquiries, please feel free to contact us.

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