INNOVACERA | technical ceramic solutions

Are you struggling with device overheating?   High temperatures can kill your electronics, reduce performance, and shorten lifespan. 1   This problem often starts where you least expect it. Aluminum Nitride (AlN) is a high-performance ceramic substrate crucial for managing heat in demanding electronic applications. It offers  exceptional thermal conductivity 2 , allowing heat to rapidly dissipate from critical components before it reaches the heatsink, thus preventing performance degradation and failures. From our 13+ years in ceramic substrates, I've seen many thermal challenges. My experience shows the bottleneck is often earlier, before the heatsink. We believe effective thermal management begins right at substrate selection. Content   Hide 1   Why is substrate choice critical for thermal path optimization? 2   How does Aluminum Nitride improve thermal dissipation before the heatsink? 3   Where does Aluminum Nitride truly shine in high-power applica...

Aluminum Nitride Aluminium nitride is a high performance material particularly suited to demanding electrical applications. Typical aluminium nitride characteristics include: 1.Very good thermal conductivity 2.Thermal expansion coefficient similar to that of silicon 3.Good dielectric properties 4.Good corrosion resistance 5.Stability in semiconductor processing atmospheres Typical aluminium nitride applications include: 1.Heat sinks 2.Electronic substrates 3.IC packages 4.Power transistor bases 5.Microwave device packages

Aluminum Nitride Ceramics exhibit exceptional characteristics as below: Good mechanical properties, Higher flexural strength than Al2O3 and BeO ceramics, High temperature and corrosion resistance. High thermal conductivity combined with good electrical insulation characteristics. Exceptional stability when exposed to many molten salts. Thermal stability up to at least 1500°C Favorable mechanical characteristics extending into the high temperature range. Low thermal expansion and resistance to thermal shock. Special optical and acoustic characteristics. Physical Properties: Properties Value Color  Dark Gray Main Content 96%ALN Bulk Density(g/cm 3 ) 3.335 Water Absorption 0.00 Flexural Strength(MPa) 382.70 Dielectric Constant(1MHz) 8.56 Coefficient Linear Thermal Expansion(/℃，5℃/min, 20-300℃) 2.805*10 -6 Thermal Conductivity(30 degree Celsius) >=170 Chemical Durability(mg/cm2) 0.97 Thermal Shocking Resistance No cracks Volume Resistivity(Ω.cm) (20 degree Celsius) 1.4*10 14 Dielect...

Aluminum nitride   (AIN) is known for its high thermal conductivity and excellent electrical insulation properties. It is a common ceramic material used in a variety of electrical devices. In addition to its coefficient of thermal expansion and electrical insulation capabilities,   aluminum nitride ceramics   are resistant to most molten metals, such as copper, lithium and aluminum. Properties of aluminum nitride ceramics: Aluminum nitride has a variety of properties that make it suitable for a variety of industrial applications: High thermal conductivity (above 170 W/mK). This is close to the value of BeO and SiC and more than five times that of aluminum oxide (Al2O3). Its coefficient of thermal expansion is 4.5 *10-6°C, the same as that of silicon (3.5-4 *10-6°C). It has good light transmission properties It is not toxic. Good electrical conductivity. Aluminum nitride’s electrical properties include its dielectric constant, dielectric loss, bulk resistivity and dielectr...

Source: https://www.innovacera.com/news/hot-pressed-aluminum-nitride-ceramic-overview.html Hot pressed aluminum nitride ceramic is used in applications requiring high electrical resistivity in addition to exceptional thermal conductivity. The applications for hot-pressed AlN typically involve rigorous or abrasive environments and high-temperature thermal cycling. Below are the properties of the pressed aluminum nitride. Property Units Value Flexural Strength, MOR (20 °C) MPa 300-460 Fracture Toughness MPa m1/2 2.75-6.0 Thermal Conductivity (20 °C) W/m K 80-100 Coefficient of Thermal Expansion 1 x 10-6/°C 3.3-5.5 Maximum Use Temperature °C 800 Dielectric Strength (6.35mm) ac-kV/mm 16.0-19.7 Dielectric Loss 1MHz, 25 °C 1 x 10 -4  to 5 x 10 -4 Volume Resistivity (25°C) Ω-cm 10 13  to 10 14 The information provided on this chart is for general material property reference only. Example Applications: Semiconductor heaters Ballistics armor Should you have any inquiries, please...