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Mass Spectrometer Filament Assembly

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  We are pleased to introduce our new product, Filament Assembly supports , which is a drop-in replacement filament for ion trap mass spectrometers. Direct replacement for products offered by Thermo, Varian, Perkin-Elmer, Teledyne, and Hitachi. Customers can choose from two-pin and four-pin options, tensioned and aligned to maximize mass spectrometer performance. These filament assemblies are manufactured from our alumina ceramic, chosen for its good electrical insulation and high temperature stability. Innovacera’s brazing process makes the filament more resistant to temperatures of around 700 ° C, compared to standard adhesives that typically can only withstand temperatures up to 350 ° C. Welding method Ceramic to Metal Brazing (or Soldering) Glass to Metal Sealing If you are interested, please contact us. Our experienced team of engineers will select the appropriate brazing fixture, joint design, and process for your application.

99% Alumina Laser pumping cavity ceramic reflector

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The material of the ceramic reflector is   99% Al2O3 . Its green body is fired at a suitable temperature to retain the proper porosity and strength. The surface of the ceramic reflector is coated with a high-reflectivity ceramic glaze, so it has a longer service life and a more diffuse reflection compared to the gold-plated reflector. Production Process Preparation of the green body Preparation of glaze slurry: raw material weighing, grinding, sand screening Glazing: glazing by spraying Glaze burning: The glazed product is burning at a high temperature Inspection: Appearance inspection, dimensional measurement, and reflectance measurement Packaging Prime Features Surfaces can be sealed and coated with a solarization-resistant glaze to give high bulk reflectivity 97% reflectance efficiency at 600-1000nm Reflectance efficiency exceeds 95% across the wavelength range 400-1200nm (see curve) Controlled porosity Good thermal conductivity High electrical resistivity Precautions for the u...

Alumina Ceramic Metallization Disc with 3 Holes for TO Package

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  Alumina ceramic metallization discs , designed with 3 holes, were typically used in TO (Transistor Outline) packages. Providing the hermetic sealing, electrical insulation, and thermal stability in strict conditions for high-reliability electronic packaging.     Product Overview Alumina ceramic metallization is the process of applying molybdenum-manganese (Mo-Mn), then coating with Nickel on ceramics, bonding both the mechanical and electrical properties of ceramics and metals together. These three through-holes are to accommodate metal feedthrough pins, allowing for electrical interconnection while maintaining hermetic isolation. The metallized alumina disc forms the insulation base for TO packages like TO-3, TO-5, TO-8, TO-39, etc.   Application Areas -TO Packages (e.g., TO-3, TO-5, TO-8, TO-39) -Power semiconductor devices -Laser diodes and optoelectronic packaging -RF and microwave device packaging -High-reliability and hermetically sealed sensors -Telecommunic...

Intermetallic (BN-TiB2) E-Beam Crucibles Evaporator Boat for E-Beam Sources

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  Innovacera can provide a range of crucibles for electron guns, which can also be designed and customized to meet specific needs. May I know if you have chosen the most suitable crucible for aluminum plating? This article explains in detail how to choose it. Let’s go down.     Aluminum will form alloys with tungsten crucibles, molybdenum crucibles, and tantalum crucibles, which cause corrosion on the inside of the crucible and also contaminate aluminum. At the same time, the film layer has been contaminated, such as the film being black, dark, and even spotted. Aluminum will also form yellow aluminum carbide with carbon in graphite crucibles, and the formed aluminum carbide will evaporate onto the sample, causing the film to turn yellow. The use of boron nitride crucibles, alumina crucibles, or quartz crucibles is prone to electron beam defocusing issues. The main reason is that the crucible is not conductive, and the excess electrons in the crucible accumulate, resultin...

Micro D Connectors Unveiled: Why They Matter in Today’s Technology

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  In the ever-evolving world of electronics, the demand for miniaturized, high-performance connectors is more prominent than ever. One such innovation that has captured the attention of engineers and designers alike is the   Micro-D connector . Known for its compact size and robust design, this connector has become a staple in various industries, including aerospace, defense, and telecommunications.   Understanding Micro D Connectors Micro D Connectors are small, rectangular connectors designed to offer high-density connectivity in a compact footprint. Despite their miniature size, these connectors are engineered to provide reliable electrical connections, even in the most demanding environments. With their ability to accommodate multiple pins in a confined space, Micro D Connectors are ideal for applications where space is at a premium, but performance cannot be compromised.   The Role of Glass-to-Metal Seals One of the key components that contributes to the reliabi...

Alumina Ceramic Focus Rings

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Alumina Ceramic Focus rings are designed to improve etch uniformity around the wafer edge or perimeter. When used with an electrostatic chuck (e-chuck), the wafer rests on the edge focus ring – held in place by the electrostatic charge. Alumina Ceramic Focus Rings serve as critical components within plasma etch equi pment, primarily in the etch chamber. The rings are strategically positioned to optimize plasma distribution and maintain uniformity during the etching process. Semiconductor manufacturing processes require operation within cleanroom environments, particularly for components used under high-temperature, vacuum, and corrosive gas conditions. Ceramic materials maintain high stability within these complex physical and chemical environments. The Ceramic Focus Ring is a critical part of the Semiconductor Etch Process. When aluminum alloy is chosen as the etch chamber material, it can easily cause metal particle contamination. Therefore, high-purity (over 99.5%) alumina ceramic ...

Aluminum Nitride Ceramic Part Typical Applications

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  Compared with other ceramic materials,   AlN   has a thermal expansion coefficient that matches silicon and excellent thermal conductivity, which makes it more suitable for use in the electronics industry.   Aluminium Nitride Ceramic   Material Properties is as bleolw. Aluminum nitride can also be used in heat exchangers, crucibles, protective tubes, casting molds, piezoelectric ceramics and films, thermally conductive fillers, etc. Below is some application of  Aluminum nitride ceramic components . 1. Heat dissipation substrate and electronic device packaging Heat dissipation substrates and electronic device packaging are the main applications of AlN ceramics. Aluminum nitride ceramics have excellent thermal conductivity, thermal expansion coefficient close to silicon, high mechanical strength, good chemical stability, and are environmentally friendly and non-toxic. It is considered an ideal material for a new generation of heat dissipation substrates an...