INNOVACERA | technical ceramic solutions

As the developing of the power electronics, manufacturers are looking for substrate solutions that not only deliver reliable performance but also make sense from a cost and production method. Alumina (Al₂O₃) substrates used in Direct Plated Copper (DPC) technology remain a practical and widely adopted choice across many industries.   A Reliable and Cost-Effective Material Choice   Alumina substrates have been used in electronic package for a long time due to reliable electrical insulation, strong mechanical support, and steady thermal performance, which making them a good choice for a wide range of power and electronic applications used every day.   Alumina has a great advantage for cost-effectiveness when compared with other ceramic materials. Manufacturers can reach to dependable performance without driving up overall system costs, with a well-established supply chain, stable quality, and the ability to support mass production. As a result, alumina DPC substrates are pa...

Direct Plated Copper (DPC) is a newest development in the field of Ceramic Substrate PCBs, its process is by magnetron sputtering technology to deposit a metal layer (Ti/Cu target) on the surface of the ceramic substrate which result in copper thickness’ ranging from 10um to 130um, and then photolithography to form circuit patterns. electroplating is used to fill in the gaps and thicken the metal circuit layer, and the solderability and oxidation resistance of the substrate is improved through surface treatment, finally remove the dry film and etch the seed layer to complete the substrate. Direct Plated Copper Substrate Key attributes : – Superior CTE and excellent thermal conductivity – High reliability and durability – Good Mechanically performance – Low electrical resistance conductor traces – Superior high-frequency characteristics – Fine line resolution – Low temperature process (below 300℃) guarantee the quality of ceramic and the metallized layer, also reduce the cost. Direct Pl...