Semicon Southeast Asia 2026 Exhibition and High-Performance Materials Trends

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Aluminum nitride and wafer applications at the Kuala Lumpur Semiconductor Exhibition


Participate in the Semicon Southeast Asia 2026 in Kuala Lumpur to explore the application trends of boron nitride, micro porous ceramics and alumina substrates, aluminum nitride substrates in power devices, electronic packaging and precision processing, and seize the innovation opportunities in the Asia-Pacific semiconductor industry. 

About the Semicon Southeast Asia 2026

 

In 2026, Semicon Southeast Asia 2026 will witness its annual grand event – the Semiconductor Exhibition at the Kuala Lumpur International Convention Centre.This exhibition brings together the world’s leading suppliers to showcase the latest applications and technical cases of boron nitride, micro porous ceramics, alumina substrates, aluminum nitride substrates and precision machined parts.Next, we will comprehensively introduce the exhibition bright spot, key material trends and application cases, helping enterprises and engineers understand the latest developments of advanced semiconductor materials in the fields of power devices, electronic packaging and precision processing.Semicon Southeast Asia 2026 bright spot and information

 

  • Time and Place: May 5-7, 2026, Kuala Lumpur International Convention Centre
  • Exhibition participating companies and products: Covering local and international suppliers, with a focus on showcasing high-performance substrates, precision ceramic parts and power heat dissipation components and so on

 

ItemDetails
Year / Edition2026 / 31st Edition
FormatIn-Person
Gross Area> 24,000 sqm
Targeted Companies> 500 International & Local Companies
Number of Booths> 1,000 Booths
Expected Attendees15,000 – 20,000
Show Hours9:00 – 17:00
Expected Audiences’ ProfileIndustry Leaders, Government Agencies, SMEs, Media

 

Boron nitride plate for the semiconductor industry

Aluminum nitride wafers for semiconductors

 

Main material trends and application

 

Boron Nitride Advantages and Semiconductor Application

 

  • High thermal conductivity and excellent electrical insulation
  • Heat dissipation for power devices and intelligent packaging
  • Exhibition cases: LED heat sinks, microelectronic packaging

Porous Ceramics For Microelectronic Packages

 

  • High-temperature stability and lightweightHigh-density electronic packagingExhibition example: Heat dissipation structure of semiconductor modules

Alumina and Aluminium Nitride Substrates

 

Alumina: Moderate cost, suitable for conventional power devicesAluminum nitride: High thermal conductivity, dimensional stabilityExhibition Cases: Power Modules and Precision Packaging

Alumina and aluminum nitride substrates were displayed on Semicon Southeast Asia 2026

 

Precision Machining Ceramic Components

 

    • Processing of complex micro-structures
    • Semiconductor packaging, optoelectronic devices
    • Application illustration of aluminum nitride substrate and precision ceramic parts
    • The heat dissipation module of the power device adopts microporous ceramics and boron nitride.

 

aluminum nitride precision machined ceramic parts used in the heat dissipation module of the power device

Alumina precision machined parts displaying at the Kuala Lumpur Semiconductor Exhibition

 

The advantages of Malaysia’s semiconductor industry

 

  • Asia-pacific semiconductor manufacturing base, Kuala Lumpur and Penang industrial parks
  • Complete supply chain and policy support
  • Display the practical application and demand of materials in the local industry

Contact us for further discussion

 

Our boron nitride, micro porous ceramics, alumina and aluminum nitride substrates , precision machined parts have been widely applied in Asia, Europe and the United States. Application fields: Heat dissipation of power devices, microelectronic packaging, and processing of complex and fine structures.The materials displayed at this exhibition are only some of the cases. For enterprises that need high-performance heat dissipation, precise packaging and customized substrates, we welcome you to contact us for more professional advice or visit our booth L2 2591 for further discussion.

 

Application of alumina machining parts at the Kuala Lumpur Semiconductor Exhibition


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