Inspection Video: DBC ALN substrates

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Aluminum nitride ceramics have excellent electrical and thermal properties and are considered to be the most promising high thermal conductivity ceramic substrate materials. In order to seal the package structure, mount components, and connect input and output terminals, the surface and interior of the aluminum nitride ceramic substrate need to be metalized. The reliability and performance of ceramic surface metallization have an important impact on the application of ceramic substrates, and firm bonding strength and excellent air tightness are the most basic requirements. Considering the heat dissipation of the substrate, it is also required to have a high thermal conductivity at the interface between the metal and the ceramic. The metallization methods on the surface of aluminum nitride ceramics include the thin film method, the thick film method, the high melting point metallization method, an electroless plating method, direct copper cladding method (DBC), etc. Let me introduce the most common method - Direct copper cladding (DBC) https://store.innovacera.com/aluminum-nitride-ceramic-substrate-metallization

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