INNOVACERA | technical ceramic solutions

With the continuous upgrading of data centers, AI computing power, and high-speed communication networks, optical modules are rapidly evolving towards higher bandwidth, higher integration, and smaller package sizes. From 100G, 400G to 800G and even 1.6T optical modules, the power density within a unit volume has been continuously rising. The heat generated by lasers and modulators has become a critical limiting factor affecting system performance.   Inside the optical module, the laser diode (LD) chip, high-power modulators (such as EML), and related driver circuits are extremely sensitive to operating temperature. Once the heat dissipation capacity is insufficient, it may cause wavelength drift, output power attenuation, and increase the aging speed of the device, thereby affecting the long-term reliability of the optical module and the stability of network operation.   Core solution: High-performance aluminum nitride ceramic heat dissipation substrate Aluminum nitride (AlN) ...

  Aluminum nitride   is a non-natural existence of man-made crystals, with a hexagonal crystal system of fibrous zincite crystal structure, for the covalent bond is a very strong compound, lightweight, high strength, high heat resistance, corrosion resistance, and has been used as a crucible for melting aluminum, but also as an excellent performance of electronic ceramic materials.   Aluminum nitride ceramics  with high thermal conductivity, low coefficient of expansion, high strength, high temperature resistance, chemical corrosion resistance, high resistivity, low dielectric loss, are the ideal large-scale integrated circuit heat dissipation substrate and packaging materials, the main raw material for the manufacture of high thermal conductivity aluminum nitride ceramic substrate.    Aluminum Nitride Ceramic Substrate Advantages: 1. Excellent thermal conductivity 2. Low dielectric constant 3. Low dielectric loss 4. Reliable insulation properties 5. Excell...

Aluminum Nitride Aluminium nitride is a high performance material particularly suited to demanding electrical applications. Typical aluminium nitride characteristics include: 1.Very good thermal conductivity 2.Thermal expansion coefficient similar to that of silicon 3.Good dielectric properties 4.Good corrosion resistance 5.Stability in semiconductor processing atmospheres Typical aluminium nitride applications include: 1.Heat sinks 2.Electronic substrates 3.IC packages 4.Power transistor bases 5.Microwave device packages

Aluminum nitride ceramic substrates have excellent thermal conductivity (7-10 times of alumina ceramics),low dielectric constant and dielectric loss, reliable insulation performance, excellent mechanical properties, non-toxic,high temperature resistance, chemical corrosion resistance, and the thermal expansion coefficient of silicon is similar, as a new generation of ceramic materials, more and more by people Attention and attention. Aluminum nitride substrate produced by our company lead the quality of similar domestic products, with the international advanced level, widely used in communication devices, high brightness LED, power electronic devices and other industries. Substrate thickness: 0.25mm, 0.385mm, 0.5mm, 0.635mm, 0.8mm, 1mm, 1.5mm, 2mm, 3mm AlN Substrate Application: Often used in electrical and electronic fields requiring heat conduction, heat dissipation, insulation, high temperature resistance,high voltage breakdown resistance, high thermal conductivity, good stabilit...

Hexagonal Boron Nitride has a microstructure similar to that of Graphite. In both materials this structure, made up of layers of tiny platelets, is responsible for excellent machinability and low-friction properties. we called hexagonal boron nitride (HBN) or white graphite. Material of Boron Nitride Ceramics: Pyrolytic Boron Nitride: 99.99% Boron Nitride 99 Boron Nitride: Boron Nitride + Boric Oxide (B2O3) CABN: Boron Nitride + Calcium Borate ALBN: Boron Nitride + Al2BO3 ZRBN: Boron Nitride + Zirconium Oxide + Boric Oxide (B2O3) ZABN: Boron Nitride + Zirconium Oxide + Aluminum Nitride + Al2BO3 SCBN: Boron Nitride + Silicon Carbon + Al2BO3 Applications of Boron Nitrides Ceramics: Thermal Management Excellent electrical insulation and thermal conductivity make BN very useful as a heat sink in high-power electronic applications. Its properties compare favorably with beryllium oxide, aluminum oxide, and other electronic packaging materials...

Aluminum nitride ceramics have excellent electrical and thermal properties and are considered to be the most promising high thermal conductivity ceramic substrate materials. In order to seal the package structure, mount components, and connect input and output terminals, the surface and interior of the aluminum nitride ceramic substrate need to be metalized. The reliability and performance of ceramic surface metallization have an important impact on the application of ceramic substrates, and firm bonding strength and excellent air tightness are the most basic requirements. Considering the heat dissipation of the substrate, it is also required to have a high thermal conductivity at the interface between the metal and the ceramic. The metallization methods on the surface of aluminum nitride ceramics include the thin film method, the thick film method, the high melting point metallization method, an electroless plating method, direct copper cladding method (DBC), etc. Let me introduce t...