Hot pressing Aluminum Nitride Used For Semiconductor Fabrication Equipments
Hot pressing Aluminum Nitride (AlN) ceramics are used as wafer heating plates and wafer holding electrostatic chucks in semiconductor fabrication equipments. Advantages of Hot pressing ALN Aluminum nitride ceramic: – High purity – Electrical insulator – High thermal conductivity – Critical thermal management material – Reduced Particulate Generation – Corrosion/Erosion Resistance – Controlled Electrical Properties Properties: Property Units Value Flexural Strength, MOR (20 °C) MPa 300-460 Fracture Toughness MPa m1/2 2.75-6.0 Thermal Conductivity (20 °C) W/m K 100-170 Coefficient of Thermal Expansion 1 x 10-6/°C 3.3-5.5 Maximum Use Temperature °C 800 Dielectric Strength (6.35mm) ac-kV/mm 16.0-19.7 Dielectric Loss 1MHz, 25 °C 1 x 10 -4 to 5 x 10 -4 Volume Resistivity (25°C) Ω-cm 10 13 to 10 14 Typical Application: – Cover plates and MRI equipment(Magnetic Resonance Imaging) – High-power detectors, plasma generators, military radios – Electrostatic chucks and heati...