INNOVACERA | technical ceramic solutions

  Against the backdrop of the rapid development of new energy vehicles, 5G communication, power semiconductors and the third-generation semiconductor industry, the market demand for high-performance electronic packaging ceramic materials continues to rise. Aluminum nitride (AlN) and silicon nitride (Si₃N₄) ceramic substrates , with their comprehensive advantages of high thermal conductivity, high insulation, and strong structural reliability, have become the core basic carriers for IGBT modules, SiC power devices, vehicle electronic control systems, and high-end precision electronic equipment.   The quality of the finished products of high-performance nitride substrates not only depends on the powder formula, molding process and sintering curve, but also the supporting fixtures during the sintering process are a key link determining the flatness, surface quality and batch yield of the substrates. During the high-temperature sintering process, thin substrate bodies are prone t...

As the developing of the power electronics, manufacturers are looking for substrate solutions that not only deliver reliable performance but also make sense from a cost and production method. Alumina (Al₂O₃) substrates used in Direct Plated Copper (DPC) technology remain a practical and widely adopted choice across many industries.   A Reliable and Cost-Effective Material Choice   Alumina substrates have been used in electronic package for a long time due to reliable electrical insulation, strong mechanical support, and steady thermal performance, which making them a good choice for a wide range of power and electronic applications used every day.   Alumina has a great advantage for cost-effectiveness when compared with other ceramic materials. Manufacturers can reach to dependable performance without driving up overall system costs, with a well-established supply chain, stable quality, and the ability to support mass production. As a result, alumina DPC substrates are pa...