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Showing posts with the label porous ceramic vacuum chuck

Porous ceramic chuck table used in semiconductor equipment

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  Porous ceramic chuck table  is a so important part in semiconductor equipment such as silicon wafer processing. Porous Ceramic Vacuum Chucks  are widely used as important components of equipment in silicon wafer, semiconductor compound wafer, piezoelectric ceramic, glass, LED, semiconductor package component substrate, optical component thinning, cutting and so on. The advantages include the following: Strong permeability: Uniform air permeability and water permeability to ensure the uniform stress and firm adsorption of the silicon wafer, so that it does not slip during the grinding process. Compact and uniform structure: Due to the dense and uniform  microporous ceramic , the chuck table is not easy to adsorb silicon powder abrasives and is easy to clean. High strength: No deformation during grinding, to ensure that the silicon wafer is uniformly stressed at all points during grinding, and is not easy to edge breakage and debris. Long service life: The surface sh...

Porous Ceramic Dicing and Thinning Vacuum Chuck

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  The dicing  vacuum chuck table can be made more than 12 inches, according to customer requirements with different shape like the disc, square and irregular shape. The size of thinning vacuum chuck can be matched with 3 inch wire, 4 inch wire, 5 inch wire, 6 inch wire, 8 inch wire and 12 inch wire. It can also be customized according to requirement. They are widely used for Disco, ADT, K&S, Applied materials, TSK, OKAMOTO, Micro Automation as special tools for adsorption and carrying. The main feature includes: High flatness and parallelism Good permeability and uniform adsorption High strength Long life time Easy to process

Microporous Ceramic Vacuum Chuck

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Vacuum chucks are used in the thinning, dicing, cleaning, handling, and other processes of semiconductor electronic chips, like wafers. Why choose microporous ceramic vacuum chucks? 1. During the polishing and cleaning process of wafers, polishing liquid and water mist enter the working table, causing corrosion. And the microporous ceramic vacuum chucks resist corrosion. 2. The microporous ceramic vacuum chuck has no environmental pollution such as light, heat, and electromagnetic, unlike the rubber or other materials vacuum chuck. And the rubber or other materials vacuum chuck will be in direct contact with the surface of the item, so it is very easy to wear. Therefore, the porous ceramic has high temperature resistance and chemical corrosion resistance, light structure, and electrical insulation. So it is the best choice for vacuum chuck. 3. With its special porous structure, the microporous ceramic has very small holes and can be machined to very precise flatness. Combined with...

Porous Ceramic Dicing and Thinning Vacuum Chuck

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Source: https://www.innovacera.com/news/porous-ceramic-dicing.html The dicing vacuum chuck table can be made more than 12 inches, according to customer requirements with different shape like the disc, square and irregular shape. The size of thinning vacuum chuck can be matched with 3 inch wire, 4 inch wire, 5 inch wire, 6 inch wire, 8 inch wire and 12 inch wire. It can also be customized according to requirement. They are widely used for Disco, ADT, K&S, Applied materials, TSK, OKAMOTO, Micro Automation as special tools for adsorption and carrying. The main feature includes: High flatness and parallelism Good permeability and uniform adsorption High strength Long life time Easy to process

Porous ceramic chuck table used in semiconductor equipment

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Source: https://www.innovacera.com/news/ceramic-chuck-table.html Porous ceramic chuck table is a so important part in semiconductor equipment such as silicon wafer processing. Porous Ceramic Chuck Tables are widely used as important components of equipment in silicon wafer, semiconductor compound wafer, piezoelectric ceramic, glass, LED, semiconductor package component substrate, optical component thinning, cutting and so on. The advantages include the following: Strong permeability: Uniform air permeability and water permeability to ensure the uniform stress and firm adsorption of the silicon wafer, so that it does not slip during the grinding process. Compact and uniform structure: Due to the dense and uniform microporous ceramic, the chuck table is not easy to adsorb silicon powder abrasives and is easy to clean. High strength: No deformation during grinding, to ensure that the silicon wafer is uniformly stressed at all points during grinding, and is not easy to edge breakag...

Porous Ceramic Chuck Table

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Source: https://www.innovacera.com/news/porous-ceramic-chuck-table.html The ceramic chuck table is applied to the fields of silicon wafer, semiconductor compound wafer, piezoelectric ceramic, glass, LED, semiconductor package component substrate, optical component thinning, cutting, and so on. Main Application field: New and refurbished, porous ceramic chucks for Disco, ADT, K&S, Applied materials TSK, OKAMOTO, Micro Automation, Load Point, etc. dicing saws and grinders. 4", 5", 6", 8", 12" regular size available in round, square, oval shape or irregular shapes and sizes. INNOVACERA porous ceramic vacuum chucks are available for a wild array of shapes and sizes for thin-film substrates and other flat fragile materials, the chuck's superb flat surface of porous ceramic distributes the vacuum force equally to mitigate any potential deflection. We have developed: Dicing Chucks Transparent Chucks Cleaning Chucks Printing Chucks Thinning ...