Microporous Ceramic Vacuum Chuck for Semiconductor Manufacturing: Ceramic-Metal Hybrid Design
In the fields of semiconductor, optics, and high-precision electronic manufacturing, stable workpiece clamping and damage-free transfer have always been critical process steps. As process precision continues to improve, the limitations of traditional porous metal vacuum chucks in terms of uniformity, cleanliness, and long-term stability have become increasingly evident, driving the development and application of a new generation of ceramic-metal composite micro-porous vacuum chucks. This type of vacuum suction cup typically uses high-performance microporous ceramic as the adsorption functional layer, integrated with a metal flange base structure in a unified design to achieve synergistic optimization of performance and structural strength. 01 The Key Role of Micro-porous Ceramic Adsorption Surface On the adsorption end face, the product employs high-purity alumina (Al2O3) or silicon carbide (SiC) micro-porous ceramic materials, which are precisely sintered to form a...