INNOVACERA | technical ceramic solutions

  Innovacera manufactures many kinds of metalized ceramic coil bodies for electrical inductors, including the H-shapes, U shape and Bone-shaped and so on. The main material of metalized ceramic coil bodies is   96 Alumina   and the metallized coating material is W, Ni, Au etc. Our factory have more than 20 years of metalized ceramics producing experiences, can give a prompt solution for R&D project. The metalized bodies is partially metalized , ceramic inductor coil bodies cores can make very small size which it is big helpful for the electrical systems , wire-winding technique, electronics devices and electrical coils components miniaturization developed. Metallized Alumina Ceramic Coil Bodies Features: Extremely highmechanical strength Excellent bond strength of the metalization. High precision tolerance Goodsoldering behavior Metalized Ceramic Coil Bodies  Application: MobilePhones Digital Cameras Notebook Comp...

  Metallized ceramic bushings are widely used in the joining process of ceramics and metals. Ceramics have excellent insulation properties and can be well combined with metals through the   metallization   process. In addition to standard bushings, INNOVACERA is available in many custom shapes and sizes. INNOVACERA also has brazing capabilities and can provide a one-stop service from ceramics to brazed components. This serivce allows us to offer finished hermetically sealed ceramic terminals for assembly. Part #           D           A           J IN-CM-400        0.494        0.143        0.309 IN-CM-400-1        0.494        0.169        0.309 IN-CM-400-1M        0.494 ...

  Innovacera manufactures many kinds of metalized ceramic coil bodies for electrical inductors, including the H-shapes, U shape and Bone-shaped and so on. The main material of metalized ceramic coil bodies is   96 Alumina   and the metallized coating material is W, Ni, Au etc. Our factory have more than 20 years of metalized ceramics producing experiences, can give a prompt solution for R&D project. The metalized bodies is partially metalized , ceramic inductor coil bodies cores can make very small size which it is big helpful for the electrical systems , wire-winding technique, electronics devices and electrical coils components miniaturization developed. Metallized Alumina Ceramic Coil Bodies Features: Extremely highmechanical strength Excellent bond strength of the metalization. High precision tolerance Goodsoldering behavior Metalized Ceramic Coil Bodies  Application:   MobilePhones Digital Cameras Notebo...

INNOVACERA supplies custom refractory metalized alumina ceramics for use in power grid tubes, x-ray tubes, vacuum interrupters, and similar applications where ceramic-to-metal seal joints of exceptional strength and hermeticity are required. Ceramic material: Aluminum Oxide Beryllium Oxide Deposition methods: Screen printing Pad printing Brush coating A coating of molybdenum-based paint followed by nickel plating can provide an interface where the ceramic/metal component can be formed by brazing, providing a sealed joint. After sintering, a layer of molybdenum-manganese alloy with a thickness of 10–30 μm was deposited. The metallization sintering process is carefully controlled to achieve a balanced mixture of molybdenum particles surrounded by a glass matrix to insure high bond strength between the metallization layer and the ceramic matrix. Contact us today with your requirements and our sales engineers will work with you to provide the correct product to meet...

Source: https://www.innovacera.com/news/ceramics-and-metals-to-achieve.html Ceramics are often referred to as inorganic non-metallic materials. It can be seen that people directly position ceramics on the opposite side of metal. After all, the performance of the two is worlds apart. But the advantages of the two are too prominent, so in many cases, it is necessary to combine ceramics and metals, each showing their strengths, so the technology-ceramic metalization technology was born. Especially with the advent of the 5G era, the power of semiconductor chips continues to increase. The development trend of lightness and high integration is becoming more and more obvious, and the importance of heat dissipation is also becoming more and more prominent. This undoubtedly puts more stringent requirements on package heat dissipation materials. In the packaging structure of power electronic components, the packaging substrate serves as a key link for connecting the upper and lower parts ...