INNOVACERA | technical ceramic solutions

Direct Plated Copper (DPC) is a newest development in the field of Ceramic Substrate PCBs, its process is by magnetron sputtering technology to deposit a metal layer (Ti/Cu target) on the surface of the ceramic substrate which result in copper thickness’ ranging from 10um to 130um, and then photolithography to form circuit patterns. electroplating is used to fill in the gaps and thicken the metal circuit layer, and the solderability and oxidation resistance of the substrate is improved through surface treatment, finally remove the dry film and etch the seed layer to complete the substrate. Direct Plated Copper Substrate Key attributes : – Superior CTE and excellent thermal conductivity – High reliability and durability – Good Mechanically performance – Low electrical resistance conductor traces – Superior high-frequency characteristics – Fine line resolution – Low temperature process (below 300℃) guarantee the quality of ceramic and the metallized layer, also reduce the cost. Direct Pl...

DPC ceramic substrates are an ideal material for growing VCSEL laser diodes due to their high thermal conductivity, low thermal expansion coefficient, and excellent mechanical properties. The direct bonding process used to create DPC substrates ensures that the copper layer is tightly bonded to the ceramic layer, providing excellent thermal management properties. In addition, DPC ceramic substrates have a coefficient of thermal expansion (CTE) that is well-matched to the epitaxial layers of the VCSEL laser diodes. This ensures that the diodes remain stable and reliable over a wide range of temperatures, making them suitable for use in a variety of applications. Using DPC ceramic substrates can also improve the performance of VCSEL laser diodes by reducing the threshold current and increasing the output power. This is due to the excellent thermal management properties of the DPC substrate, which can dissipate heat more efficiently and prevent thermal runaway. In summary, the use of DPC...