INNOVACERA | technical ceramic solutions

  Innovacera Ceramic Thermally Conductive Interface Pads   are designed to provide a preferential heat-transfer path between heat-generating components, heat sinks, and other cooling devices. The pads are used to fill air gaps caused by imperfectly flat or smooth surfaces which should be in thermal contact. The pads are made by ceramic material such as alumina ceramic and aluminum nitride, which help in providing enhanced thermal conductivity and excellent insulation performance. Aluminum Nitride Ceramic Thermal Pads Regular Size: For Package Type: TO-3P/TO-220/TO-247/TO-264/TO-3/TO-254/TO-257/TO-258, With Hole or Without Hole. TO-3P        25x20x1mm (other thickness is available, too); TO-220      20x14x1mm (other thickness is available, too); TO-247      22x17x0.635mm (other thickness is available, too); TO-264      28x22x1mm (other thickness is available, too); TO-3          39.7×...

  Application of Ceramic Heat Dissipation in Battery Cooling System At present, the thermal management of power battery systems can be mainly divided into four categories: natural cooling, air cooling, liquid cooling, and direct cooling.   Among them, natural cooling is a passive thermal management method, while air cooling, liquid cooling, and direct cooling are active methods. The main difference between the three is the difference in heat exchange medium.   Traditional battery cooling system: To change the temperature difference between the battery core and the cooling system, liquid cooling system refrigeration is the most useful method.   How does ceramic heat dissipation apply to battery heat dissipation? Replace insulating plastic materials with low thermal conductivity with  ceramic materials  with high thermal conductivity. The research shows that rapid heat dissipation and temperature equalization can be achieved by using the high thermal conducti...

Components of modern technology products, such as computer chips or light-emitting diodes, generate more and more waste heat during operation, and generally existing heat dissipation devices used to assist heat dissipation components usually include at least a metal heat sink and a fan conducts the waste heat from the operation of the heating element through the heat sink to remove it by air convection, and uses the fan to forcibly accelerate the convection of the air around the heating element to achieve the effect of rapid heat removal. However, the heat transfer coefficient of existing metal heat sinks is not very good. Therefore, heat sinks made of ceramic materials with better heat transfer characteristics appear on the market in order to achieve better heat dissipation effects. Ceramic heat sink classification There are aluminum oxide heat sinks, aluminum nitride heat sinks, and silicon carbide heat sinks . There is the performance comparison between the usual heatsink VS ceramic...

TO-3P/220/247/254/257/258/264 Aluminum Nitride Ceramic Thermal Pads For MOSFET Transistor IGBT Transistor Heat Sink Innovacera Ceramic Thermally Conductive Interface Pads are designed to provide a preferential heat-transfer path between heat-generating components, heat sinks, and other cooling devices. The pads are used to fill air gaps caused by imperfectly flat or smooth surfaces which should be in thermal contact. The pads are made of ceramic materials such as alumina ceramic and  aluminum nitride , which help in providing enhanced thermal conductivity and excellent insulation performance. Typical applications include Power Devices, Integrated Circuit (IC) chip packaging heat conduction,  MOSFET Transistor, IGBT Transistor Heat Sink, MOS Transistor, heat sink interface, LED board Thermal Interface Material (TIM), Chip ON Film (COF) heat conduction. TO-3P-220-247-254-257-258-264 Aluminum Nitride Ceramic Thermal Pads Without Hole For MOSFET Transistor IGBT Transistor Heat Sin...