INNOVACERA | technical ceramic solutions

  Innovacera Ceramic Thermally Conductive Interface Pads   are designed to provide a preferential heat-transfer path between heat-generating components, heat sinks, and other cooling devices. The pads are used to fill air gaps caused by imperfectly flat or smooth surfaces which should be in thermal contact. The pads are made by ceramic material such as alumina ceramic and aluminum nitride, which help in providing enhanced thermal conductivity and excellent insulation performance. Aluminum Nitride Ceramic Thermal Pads Regular Size: For Package Type: TO-3P/TO-220/TO-247/TO-264/TO-3/TO-254/TO-257/TO-258, With Hole or Without Hole. TO-3P        25x20x1mm (other thickness is available, too); TO-220      20x14x1mm (other thickness is available, too); TO-247      22x17x0.635mm (other thickness is available, too); TO-264      28x22x1mm (other thickness is available, too); TO-3          39.7×...

TO-3P/220/247/254/257/258/264 Aluminum Nitride Ceramic Thermal Pads For MOSFET Transistor IGBT Transistor Heat Sink Innovacera Ceramic Thermally Conductive Interface Pads are designed to provide a preferential heat-transfer path between heat-generating components, heat sinks, and other cooling devices. The pads are used to fill air gaps caused by imperfectly flat or smooth surfaces which should be in thermal contact. The pads are made of ceramic materials such as alumina ceramic and  aluminum nitride , which help in providing enhanced thermal conductivity and excellent insulation performance. Typical applications include Power Devices, Integrated Circuit (IC) chip packaging heat conduction,  MOSFET Transistor, IGBT Transistor Heat Sink, MOS Transistor, heat sink interface, LED board Thermal Interface Material (TIM), Chip ON Film (COF) heat conduction. TO-3P-220-247-254-257-258-264 Aluminum Nitride Ceramic Thermal Pads Without Hole For MOSFET Transistor IGBT Transistor Heat Sin...