INNOVACERA | technical ceramic solutions

In aerospace, electrical and medical equipment applications, maintaining hermeticity and electrical isolation is critical. Ensuring a reliable seal against environmental contaminants while facilitating the transmission of electrical signals requires sophisticated solutions.   Ceramic feedthroughs   have emerged as indispensable components, offering unparalleled performance in achieving hermeticity and electrical isolation in demanding environments. Ceramic feedthroughs serve as conduits for electrical signals, allowing them to pass through barriers such as vacuum chambers, pressure vessels, or hermetically sealed enclosures while maintaining a tight seal against moisture, gases, and other contaminants. This benefits makes ceramic feedthroughs essential in applications where need the reliability and durability.   Innovacera ceramic-to-metal feedthroughs insulators are made by high purity alumina ceramics and Metals are made by stainless steel, nickel, copper, nickel-iron a...

  Pain Points in Thick- and Thin-Film Circuit Fabrication and Ceramic Substrate Advantages In the pursuit of high performance and high reliability in electronic manufacturing, traditional substrate materials have become increasingly unable to meet the ever more demanding requirements. Limited thermal conductivity, poor high-temperature stability and insufficient surface accuracy are becoming the bottlenecks for the development of thick-film and thin-film circuits. Therefore, the industry urgently needs a new type of carrier that combines excellent insulation, efficient heat dissipation, outstanding dimensional stability and ideal surface flatness to support the printing and sintering processes of precision circuits.   Core performance requirements of thick film/film circuits for the substrate:   In the field of high-performance electronics, thick-film and thin-film circuits are two crucial microfabrication technologies. Although their processing paths are different, they ...

  Innovacera will attend Productronica 2025, the world’s leading trade fair for electronic development and production, from November 18–21, 2025, at the Trade Fair Center Messe München. We invite you to visit us at Booth B2 Hall 1409 to explore how our technical ceramic solutions address critical challenges in electronic manufacturing, from high-density packaging to thermal management and precision assembly. Ceramic Packages: The Gateway to Advanced Electronic Manufacturing Productronica 2025 brings together the global electronics industry, featuring innovations in PCB, semiconductor, and assembly technologies. As electronic devices evolve toward miniaturization and higher power densities, traditional materials struggle to meet demands for reliability, thermal performance, and hermeticity. Innovacera’s technical ceramics offer exceptional electrical insulation, high-temperature resistance, and tailored thermal properties, making them ideal for next-generation electronic application...

  In powder metallurgy (PM) processes, boron nitride and zirconia ceramic nozzles are used depending on the type of metal materials.     Main Features of Ceramic Nozzles   High-temperature resistance: withstands temperatures above 1500  ° C from molten metals or plasma flames.   Wear resistance: resists erosion from powder or gas flow for long-term operation.   Chemical inertness: does not react with active metals or gases.     Applications at Different Stages of Powder Metallurgy Stage Process Functions of Nozzles Ceramic Nozzles Typical Metals Powder Preparation Gas Atomization High-pressure inert gas (such as nitrogen or argon) impinges on the molten metal stream to form fine powder; ceramic nozzles control flow and particle size. Boron Nitride and Zirconia High-purity or reactive metals such as titanium and nickel-based alloys. Water Atomization Ceramic nozzles provide corrosion resistance and precise flow control. Zirconia Used in high-...

  In the electric drive system (motor driver/Inverter) of new energy vehicles, the IGBT power module or power semiconductor module is the core component. They are responsible for converting the direct current (DC) from the battery into alternating current (AC) to drive the motor, while also withstanding high currents, high voltages, and frequent thermal cycles.   Silicon nitride (Si3N4) ceramic   substrates , with their high thermal stability, high mechanical strength, and excellent electrical insulation properties, have become an indispensable basic material for these power modules.     It is usually used as the internal support and heat dissipation substrate within the module, directly supporting IGBT or diode chips, and combining with the copper leads or metallization layers in the module packaging to form an “insulated and highly conductive” core structure, thereby ensuring the stable operation of the electric drive system under high power density and harsh ...