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Showing posts from May, 2025

Ceramic Packages For Semiconductor Discrete Device Power Electronics

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Innovacera develops ceramic packages and metal packaging shells to meet customer customized requirements. Innovacera’s factory has established robust capabilities in the research and development of ceramic and glass materials, tape casting for green ceramics, microwave/RF simulation, packaging technologies including the ceramic packaging shells/substrates, brazing/sealing, and surface treatment processes, offering customers comprehensive and integrated packaging solutions.   Innovacera offers ceramic packages for semiconductor discrete device power electronics by using ceramic-to-metal sealing technologies. Ceramic packages adopt a ceramic sidewall structure instead of the traditional bead-type insulated ceramic design, significantly improving the voltage withstand performance of the housing. Copper-cored kovar lead pins and WCu heat sinks are bonded onto multilayer alumina ceramic packages or aluminium nitride ceramic packages. It is primarily used for encapsulating high-power tra...

Metalized Ceramic Coil Bodies

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  Innovacera manufactures many kinds of metalized ceramic coil bodies for electrical inductors, including the H-shapes, U shape and Bone-shaped and so on. The main material of metalized ceramic coil bodies is   96 Alumina   and the metallized coating material is W, Ni, Au etc. Our factory have more than 20 years of metalized ceramics producing experiences, can give a prompt solution for R&D project. The metalized bodies is partially metalized , ceramic inductor coil bodies cores can make very small size which it is big helpful for the electrical systems , wire-winding technique, electronics devices and electrical coils components miniaturization developed. Metallized Alumina Ceramic Coil Bodies Features: Extremely highmechanical strength Excellent bond strength of the metalization. High precision tolerance Goodsoldering behavior Metalized Ceramic Coil Bodies  Application: MobilePhones Digital Cameras Notebook Comp...

MCH Heater Used for Mass Spectrometers

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  Mass spectrometers are a technique for analyzing and identifying chemical substances by arranging gaseous ions in electromagnetic fields based on their mass-to-charge ratios.   Mass spectrometers can detect most analytes per borehole, so it is essential to have a non-contaminating heat source. In addition, competing requirements for instrument designs to reduce size and complexity while increasing sensitivity are being challenged.   Mass spectrometer  heating elements , also called source heaters or gas line heaters, are used in mass spectrometers to turn the sample (typically in an aqueous or organic solution) into a vapor for analysis. Before the analyzer and detector areas, the heaters are part of the sample conditioning system, where the vaporized sample is then bombarded by ionized high-energy electrons and analyzed.   Heaters used in mass spectrometers are compact in design and provide a fairly high power density. They are fast responding and operat...

Join INNOVACERA at the Ceramic Japan 2025!

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  Join INNOVACERA at the Ceramic Japan 2025! May 14–16, 2025 | INTEX Osaka, Japan | Booth Hall 4, 19-26 Explore precision components, innovative solutions, and industry trends—where innovation meets functionality! 🌟

Ceramic quadrupole for mass spectrometer

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The performance of the quadrupole, one of the core components of a mass spectrometer, directly determines the resolution, sensitivity and stability of the instrument. Traditional metal quadrupoles are gradually being replaced by high-performance ceramic quadrupoles due to problems such as insufficient thermal stability and mass discrimination effect.   Material selection of ceramic quadrupoles   1.Material comparison Material Al2O3 AlN BeO SiC Thermal conductivity 20-30 W/mK 170-200 W/mK 300 W/mK 120-200 W/mK Dielectric loss Medium Low Very low Low Coefficient of thermal expansion 8.0×10⁻⁶/K 4.5×10⁻⁶/K 7.5×10⁻⁶/K 4.0×10⁻⁶/K   2.Key material performance requirements -High thermal conductivity: fast heat dissipation, reducing field distortion caused by thermal deformation.   -Low dielectric loss: avoid radio frequency (RF) signal attenuation.   -High dimensional stability: extremely low thermal expansion under temperature fluctuations (CTE matching metal electrode...