Ceramic Packaging Enclosure
Ceramic packaging is the “case” that uses ceramic materials (like alumina, aluminum nitride, or beryllium oxide) as the housing or substrate for integrated circuits. It’s a protective enclosure or base that prevents the semiconductor chip from environmental damage and provides electrical connections to the outside world. Material Properties Property Value 92F 93D Color – – 黑色 白色 Al 2 O 3 Content – % 92 93 Density 25℃ g/cm 3 3.7 3.65 Thermal Conductivity 25℃ W/(m· K) 20 18 Coefficient of Linear Thermal Expansion 40℃~400℃ x10 -6 /℃ 6.7 7 40℃~800℃ 6.9 7.2 Volume Resistance 20℃ Ω ·cm 10 14 10 14 300℃ 10 10 10 10 500℃ 10 8 10 9 Dielectric Constant 1MHZ – 10 9 Dielectric Loss 1MHZ x10 -4 4 4 Flexural Strength 0.5mm/min MPa 400 400 Ceramic packaging shells come in various structural forms depending on the characteristics and operating environments of different devices. 1. Ceramic Small Outline Package (CSOP) Features: Compact size, wing-shaped leads, low stress Excellent res...