INNOVACERA | technical ceramic solutions

Vacuum chucks are used in the thinning, dicing, cleaning, handling, and other processes of semiconductor electronic chips, like wafers. Why choose microporous ceramic vacuum chucks? 1. During the polishing and cleaning process of wafers, polishing liquid and water mist enter the working table, causing corrosion. And the microporous ceramic vacuum chucks resist corrosion. 2. The microporous ceramic vacuum chuck has no environmental pollution such as light, heat, and electromagnetic, unlike the rubber or other materials vacuum chuck. And the rubber or other materials vacuum chuck will be in direct contact with the surface of the item, so it is very easy to wear. Therefore, the porous ceramic has high temperature resistance and chemical corrosion resistance, light structure, and electrical insulation. So it is the best choice for vacuum chuck. 3. With its special porous structure, the microporous ceramic has very small holes and can be machined to very precise flatness. Combined with...

Aluminum nitride ceramics have excellent electrical and thermal properties and are considered to be the most promising high thermal conductivity ceramic substrate materials. In order to seal the package structure, mount components, and connect input and output terminals, the surface and interior of the aluminum nitride ceramic substrate need to be metalized. The reliability and performance of ceramic surface metallization have an important impact on the application of ceramic substrates, and firm bonding strength and excellent air tightness are the most basic requirements. Considering the heat dissipation of the substrate, it is also required to have a high thermal conductivity at the interface between the metal and the ceramic. The metallization methods on the surface of aluminum nitride ceramics include the thin film method, the thick film method, the high melting point metallization method, an electroless plating method, direct copper cladding method (DBC), etc. Let me introduce t...