In the modern electronics industry, the three types of ceramic packaging and component technologies, namely HTCC, LTCC and MLCC, jointly form the foundation of high-performance electronic systems. Although they all belong to the multi-layer ceramic technology system, their application directions and performance emphases are different: HTCC is used for high-reliability and high-power packaging, LTCC excels in integrating high-frequency and multi-functional circuits, and MLCC is the core type of surface-mount passive components. These three factors jointly support the high performance and miniaturization development of modern electronic devices. This article mainly introduces the HTCC packaging technology: HTCC packaging combines alumina or aluminum nitride porcelain wafers with tungsten/molybdenum metal circuits through a set of precision ceramic-metal co-firing process, and finally forms a high-density, highly reliable three-dimensional cera...