INNOVACERA | technical ceramic solutions

  Against the backdrop of the rapid development of new energy vehicles, 5G communication, power semiconductors and the third-generation semiconductor industry, the market demand for high-performance electronic packaging ceramic materials continues to rise. Aluminum nitride (AlN) and silicon nitride (Si₃N₄) ceramic substrates , with their comprehensive advantages of high thermal conductivity, high insulation, and strong structural reliability, have become the core basic carriers for IGBT modules, SiC power devices, vehicle electronic control systems, and high-end precision electronic equipment.   The quality of the finished products of high-performance nitride substrates not only depends on the powder formula, molding process and sintering curve, but also the supporting fixtures during the sintering process are a key link determining the flatness, surface quality and batch yield of the substrates. During the high-temperature sintering process, thin substrate bodies are prone t...

UVC LED technology has become more important in disinfection, air purification, medical sterilization and industrial applications. Emitting 200–280nm ultraviolet light, modern UVC LEDs is better than traditional UV lamps in energy efficiency, service life and environmental safety. Even so, stable and efficient operation depend on a well-designed Ceramic PCB, which defines the overall reliability of UVC modules.   Many designers face challenges in meeting strict demands for heat dissipation, UV durability and electrical stability. So a high-performance Ceramic PCB solutions is important for the unique operating conditions of UVC LED devices.   Compared with common FR4 and metal-core boards, Ceramic PCB delivers overwhelming advantages. High-power UVC chips generate continuous heat during operation; without effective heat transfer, light decay and premature failure are inevitable. Ceramic PCB adopts high-purity alumina and aluminum nitride materials. 96% alumina balances cost an...

  Pain Points in Thick- and Thin-Film Circuit Fabrication and Ceramic Substrate Advantages In the pursuit of high performance and high reliability in electronic manufacturing, traditional substrate materials have become increasingly unable to meet the ever more demanding requirements. Limited thermal conductivity, poor high-temperature stability and insufficient surface accuracy are becoming the bottlenecks for the development of thick-film and thin-film circuits. Therefore, the industry urgently needs a new type of carrier that combines excellent insulation, efficient heat dissipation, outstanding dimensional stability and ideal surface flatness to support the printing and sintering processes of precision circuits.   Core performance requirements of thick film/film circuits for the substrate:   In the field of high-performance electronics, thick-film and thin-film circuits are two crucial microfabrication technologies. Although their processing paths are different, they ...

  Innovacera will attend Productronica 2025, the world’s leading trade fair for electronic development and production, from November 18–21, 2025, at the Trade Fair Center Messe München. We invite you to visit us at Booth B2 Hall 1409 to explore how our technical ceramic solutions address critical challenges in electronic manufacturing, from high-density packaging to thermal management and precision assembly. Ceramic Packages: The Gateway to Advanced Electronic Manufacturing Productronica 2025 brings together the global electronics industry, featuring innovations in PCB, semiconductor, and assembly technologies. As electronic devices evolve toward miniaturization and higher power densities, traditional materials struggle to meet demands for reliability, thermal performance, and hermeticity. Innovacera’s technical ceramics offer exceptional electrical insulation, high-temperature resistance, and tailored thermal properties, making them ideal for next-generation electronic application...

  As being intelligence and electrification in various industries, ceramic substrates have become an indispensable foundational material in power electronics, semiconductor packaging, and microelectronics. These products act as key of electronic components, serving as packaging and interconnect materials used to support, connect, dissipate heat, and protect them. With independent R&D system and comprehensive production processes, Innovacera offers high-performance ceramic products for a variety of applications, including 96% aluminum oxide (Al₂O₃), aluminum nitride (AlN), zirconium oxide (ZTA), and silicon carbide (Si₃N₄) substrates.   Multi-series product matrix, accurately matching diverse application needs     Innovacera provides ceramic substrates made of different materials to meet different customer applications:   1. 96 Alumina  (Al₂O₃) Features: Low warpage, High thermal shock resistance, low warpage, high-temperature and resistant to acid and a...

AMB ( Active Metal Brazing ) is a method of sealing ceramics and metals developed on the basis of DBC technology.   Compared with traditional DBC substrates,  ceramic substrates  prepared by AMB process not only have higher thermal conductivity and better copper layer bonding, but also have advantages such as lower thermal resistance and higher reliability. In addition, because its processing process can be completed in one heating, it is easy to operate, has a short time cycle, good sealing performance and a wide range of applications for ceramics, so this process has developed rapidly at home and abroad and has become a commonly used method in electronic devices. AMB process description AMB is to add active elements to the brazing material, form a reaction layer on the ceramic surface through chemical reaction, improve the wettability of the brazing material on the ceramic surface, so that the ceramic and the metal can be directly brazed and sealed. Usually, the active ...