INNOVACERA | technical ceramic solutions

  Innovacera develops ceramic packages and metal packaging shells to meet customer customized requirements. Innovacera’s factory has established robust capabilities in the research and development of ceramic and glass materials, tape casting for green ceramics, microwave/RF simulation, packaging technologies including the ceramic packaging shells/substrates, brazing/sealing, and surface treatment processes, offering customers comprehensive and integrated packaging solutions.     Innovacera offers ceramic packages for semiconductor discrete device power electronics by using ceramic-to-metal sealing technologies. Ceramic packages adopt a ceramic sidewall structure instead of the traditional bead-type insulated ceramic design, significantly improving the voltage withstand performance of the housing. Copper-cored kovar lead pins and WCu heat sinks are bonded onto multilayer alumina ceramic packages or aluminium nitride ceramic packages. It is primarily used for encapsulating ...

Innovacera develops ceramic packages and metal packaging shells to meet customer customized requirements. Innovacera’s factory has established robust capabilities in the research and development of ceramic and glass materials, tape casting for green ceramics, microwave/RF simulation, packaging technologies including the ceramic packaging shells/substrates, brazing/sealing, and surface treatment processes, offering customers comprehensive and integrated packaging solutions.   Innovacera offers ceramic packages for semiconductor discrete device power electronics by using ceramic-to-metal sealing technologies. Ceramic packages adopt a ceramic sidewall structure instead of the traditional bead-type insulated ceramic design, significantly improving the voltage withstand performance of the housing. Copper-cored kovar lead pins and WCu heat sinks are bonded onto multilayer alumina ceramic packages or aluminium nitride ceramic packages. It is primarily used for encapsulating high-power tra...