INNOVACERA | technical ceramic solutions

  Ceramic materials , which have excellent properties such as high hardness, high abrasion resistance and high corrosion resistance, but with poor electrical conductivity and weldability to limit their application. While metallization is a process of coating metal on the surface of ceramics, which can improve the conductivity and weldability of ceramics, thus expanding their range of applications. Ceramic after metallization has high thermal conductivity, insulation, heat resistance, strength and coefficient of thermal expansion that matched with the chip, and gradually developed into the ideal packaging substrate for new generation of integrated circuits, as well as power electronic modules.   The common ceramic substrate materials can be metallized include Al2O3, SiC, AlN and Si3N4.   1. Thick Film Metallization Thick film metallization is a metal paste coated on the ceramic surface through the screen-printing method, and then after high temperature drying and heat trea...

  With the development of intelligent devices in the direction of digitalization, miniaturization, low energy consumption, multifunctionalization, high reliability, etc., the closely related electronic packaging technology has also entered a period of ultra -high -speed development. Commonly used electronic packaging substrate materials include three categories: organic packaging substrate, metal base composite substrate, and ceramic packaging substrate. With the evolution of intelligent devices, traditional substrate materials can no longer meet the current needs of the current development. Therefore, the base board materials are evolved from organic materials, metal materials, and evolution to  ceramic materials . As we all know, ceramic materials have many advantages compared to traditional substrate materials: 1. Low communication loss – The dielectric constant of the ceramic material itself makes the signal loss smaller. 2. High thermal conductivity – the heat on the chip...