INNOVACERA | technical ceramic solutions

Ceramic to metal brazed assemblies combine electrical insulation with metal conductors,housings and mounting interfaces.They are used in vacuum feedthrough,hermetic connectors and electronic packages where power or signals must pass through a sealed boundary.   INNOVACERA supplies custom ceramic to metal components and HTCC ceramic package housings,with support for material selection,metallization, plating, brazing and inspection.     Ceramic to Metal Brazed Assemblies   A Ceramic-to-metal assembly joins an insulating ceramic body to metal parts such as pins,tubes,frames or flanges.The ceramic provides electrical isolation,while the metal provides conductive paths and mechanical connections.   Typical component configurations include:   Ceramic-to-metal vacuum feedthroughs for power and signal transmission.   Multipin hermetic connectors for instrumentation and sensor interfaces.   Metallized ceramic rings, tubes and bushings brazed to metal hard...

  Ceramic packaging is the “housing” for sealing and protecting semiconductor chips, MEMS, or other electronic components. This effectively protects Integrated circuit packaging (ICs), sensors, and other electronic devices from external environmental influences such as moisture, dust, and temperature fluctuations. As semiconductor technology advances towards higher power, smaller size, and higher frequency.   A ceramic package consists of a multilayer ceramic substrate, metal paste and a metal lid, which is made of High-Temperature Co-Fired Ceramic (HTCC) process. The core strength of this method lies in leveraging the superior physical properties inherent to ceramic materials. The ceramic materials are alumina (Al2O3) or aluminum nitride (AlN), possess excellent thermal conductivity, high electrical insulation, and superior mechanical strength.   Our ceramic hermetic packages deliver consistently high performance in leakage rates lower than 5×10⁻⁸ atm·cc/s range. And bra...