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Direct Bonded Copper Ceramic Substrates DBC ceramic substrate, short for Direct Bonded Copper Ceramic substrate, is an advanced material  composed of a ceramic substrate (typically Al2O3 or AlN) and copper, tightly joined together  through a hypo-eutectic process. This unique combination of materials results in a substrate with  exceptional thermal conductivity, low thermal expansion, high strength, and excellent wettability for  soldering applications. Direct Bonded Copper Ceramic Substrates Material Property – Low Thermal Expansion – High Strength – High Thermal Conductivity – High Wettability for Solder Direct Bonded Copper Ceramic Substrates Applied Area – Power Electronics: IGBT, MOSFET, Thyristor Module, Solid-state Relay, Diode, Power Transistors – Automotive: ABS, Power Steering, DC/DC Converter, LED Lighting, Ignition Control – Home Appliance: Air Conditioner, Peltier Cooler – Environmental Technology: Local ...

Source: https://www.innovacera.com/news/dbc-ceramic-substrate-market.html DBC (Direct Bonded Copper) substrates are composed of a ceramic insulator, Al2O3 or AlN onto which pure copper metal is attached by a high-temperature eutectic melting process and thus tightly and firmly joined to the ceramic. Key Features Ceramic metallized: Ti/W, gold(Au), silver(Ag),Copper(Cu),nickel(Ni)¡Kothers & produce final circuit Coating:0.075um to 5mil Ceramic Metallized substrate: Al2O3 substrate metallized AlN substrate metallized Silicon wafer metallized LED heat-dissipation ceramic substrate: LED Al2O3 thin film substrate LED Al2O3 thick film substrate LED AlN thin film heat-dissipation substrate Flip-chip substrate The integration of the thin film, thick film, electrode plating and electroless plating processes: Application: 1...