INNOVACERA | technical ceramic solutions

  Ceramic packaging is the “housing” for sealing and protecting semiconductor chips, MEMS, or other electronic components. This effectively protects Integrated circuit packaging (ICs), sensors, and other electronic devices from external environmental influences such as moisture, dust, and temperature fluctuations. As semiconductor technology advances towards higher power, smaller size, and higher frequency.   A ceramic package consists of a multilayer ceramic substrate, metal paste and a metal lid, which is made of High-Temperature Co-Fired Ceramic (HTCC) process. The core strength of this method lies in leveraging the superior physical properties inherent to ceramic materials. The ceramic materials are alumina (Al2O3) or aluminum nitride (AlN), possess excellent thermal conductivity, high electrical insulation, and superior mechanical strength.   Our ceramic hermetic packages deliver consistently high performance in leakage rates lower than 5×10⁻⁸ atm·cc/s range. And bra...

As optical communication, LiDAR, and high-precision optoelectronic detection systems evolve toward higher power and greater integration density, they place higher demands on the performance of optoelectronic packaging materials. The increase in device power brings challenges in heat dissipation and high-temperature stability, while the improvement in integration density raises the risks of internal stray light interference and electrostatic discharge (ESD), directly affecting system reliability and signal-to-noise ratio. Traditional white alumina has limitations in optical control, and conventional ESD protection solutions often fail to be perfectly compatible with high gas-tightness and high thermal conductivity packaging systems.   Based on the high mechanical strength, thermal conductivity, and excellent insulation properties of black  alumina ceramics , the material achieves a multi-functional integration of optical control, thermal management, and on-chip electrostatic di...

Source: https://www.innovacera.com/news/led-ceramic-package.html LED packaging materials are diverse, each has its own dominant field, and ceramic packaging has a dominant position in the field of the high power LED. The application of the LED ceramic Packages are as below: 1. Headlights for automobiles LED ceramic encapsulated light source has the advantages of shock resistance, high-temperature resistance, high reliability and so on. It is very suitable for the high-temperature harsh environment of car headlights. 2. LED Flicker Another suitable LED ceramic encapsulated light source is the smartphone flash market, the mainstream model is an aluminium nitride ceramic encapsulated device. 3. Operating Lamp 4. Chip ceramic encapsulated base If you want to know more about our ceramic material, please feel free to contact us .