INNOVACERA | technical ceramic solutions

  With the development of intelligent devices in the direction of digitalization, miniaturization, low energy consumption, multifunctionalization, high reliability, etc., the closely related electronic packaging technology has also entered a period of ultra -high -speed development. Commonly used electronic packaging substrate materials include three categories: organic packaging substrate, metal base composite substrate, and ceramic packaging substrate. With the evolution of intelligent devices, traditional substrate materials can no longer meet the current needs of the current development. Therefore, the base board materials are evolved from organic materials, metal materials, and evolution to  ceramic materials . As we all know, ceramic materials have many advantages compared to traditional substrate materials: 1. Low communication loss – The dielectric constant of the ceramic material itself makes the signal loss smaller. 2. High thermal conductivity – the heat on the chip...

  With the development of intelligent devices in the direction of digitalization, miniaturization, low energy consumption, multifunctionalization, high reliability, etc., the closely related electronic packaging technology has also entered a period of ultra -high -speed development. Commonly used electronic packaging substrate materials include three categories: organic packaging substrate, metal base composite substrate, and ceramic packaging substrate. With the evolution of intelligent devices, traditional substrate materials can no longer meet the current needs of the current development. Therefore, the base board materials are evolved from organic materials, metal materials, and evolution to  ceramic materials . As we all know, ceramic materials have many advantages compared to traditional substrate materials: 1. Low communication loss – The dielectric constant of the ceramic material itself makes the signal loss smaller. 2. High thermal conductivity – the heat on the chip...