INNOVACERA | technical ceramic solutions

  INNOVACERA’s   metallized ceramic insulators   are made by ceramic combined with thick metal films through a metallization process. This combination of ceramic and metal results in insulators that can withstand harsh conditions and provide electrical isolation when needed. Metallization Spec.: Molybdenum/Manganese (Mo/Mn) metallization: 9-30um Ni plating thickness: 3-10um Metallized Ceramic Insulators Material Properties: No Item Unit Value 1 Purity % ≥95 2 Volume density g/cm3 ≥3.6 3 Water absorption % 0 4 Thermal conductivity W/m·K( 25℃) 22.4 5 Coefficient of thermal expansion X(10-6)/℃ (20-1000℃) 8.2 6 Flexural strength Mpa 340 7 Compressive strength Mpa 2103 8 Tensile strength Mpa 193 9 Hardness ROCKWELL 45N 78 10 Withstand voltage K Vac/mm 8.3 11 Dielectric constant @1MHz 9.1 12 Dielectric loss angle @1MHz 0.0004 13 Volume resistivity @25℃ 1×10-14 @500℃ 4×10-9 @1000℃ 5×105 Metallized Ceramic Insulators Features: 1. The ceramic material is with even texture, ea...

  With the development of intelligent devices in the direction of digitalization, miniaturization, low energy consumption, multifunctionalization, high reliability, etc., the closely related electronic packaging technology has also entered a period of ultra -high -speed development. Commonly used electronic packaging substrate materials include three categories: organic packaging substrate, metal base composite substrate, and ceramic packaging substrate. With the evolution of intelligent devices, traditional substrate materials can no longer meet the current needs of the current development. Therefore, the base board materials are evolved from organic materials, metal materials, and evolution to  ceramic materials . As we all know, ceramic materials have many advantages compared to traditional substrate materials: 1. Low communication loss – The dielectric constant of the ceramic material itself makes the signal loss smaller. 2. High thermal conductivity – the heat on the chip...