Applications of Aluminum Nitride Ceramic Substrates for Integrated Circuits and Semiconductor Chip Mounts
Aluminum nitride is a non-natural existence of man-made crystals, with a hexagonal crystal system of fibrous zincite crystal structure, for the covalent bond is a very strong compound, lightweight, high strength, high heat resistance, corrosion resistance, and has been used as a crucible for melting aluminum, but also as an excellent performance of electronic ceramic materials. Aluminum nitride ceramics with high thermal conductivity, low coefficient of expansion, high strength, high temperature resistance, chemical corrosion resistance, high resistivity, low dielectric loss, are the ideal large-scale integrated circuit heat dissipation substrate and packaging materials, the main raw material for the manufacture of high thermal conductivity aluminum nitride ceramic substrate. Aluminum Nitride Ceramic Substrate Advantages: 1. Excellent thermal conductivity 2. Low dielectric constant 3. Low dielectric loss 4. Reliable insulation properties 5. Excell...