Ceramic Dual In-line Package (CDIP): Providing Stable Support for Optoelectronic Devices and MEMS
At present, consumer electronic products are always striving for high integration in packaging technology and lightweighting of the products. Although plastic packaging can become the mainstream solution due to its cost and technical advantages, in the field of high-end and high-reliability applications, ceramic packaging plays an irreplaceable role. The dual in-line package (DIP) form, which emerged in the middle of the last century, is a very classic structure. Along with the development of ceramicization, ceramic dual in-line package (DIP) enclosure have become an important carrier for key components in systems with strict long-term reliability requirements. The through-hole dual-row lead design of the ceramic dual-in-line package (CDIP) features a mature and stable assembly process. The encapsulation tube shell is usually composed of a high-purity alumina or aluminum nitride ceramic substrate, a metallized wiring layer, and an airtight welding structure, ...