INNOVACERA | technical ceramic solutions

  With the development of intelligent devices in the direction of digitalization, miniaturization, low energy consumption, multifunctionalization, high reliability, etc., the closely related electronic packaging technology has also entered a period of ultra -high -speed development. Commonly used electronic packaging substrate materials include three categories: organic packaging substrate, metal base composite substrate, and ceramic packaging substrate. With the evolution of intelligent devices, traditional substrate materials can no longer meet the current needs of the current development. Therefore, the base board materials are evolved from organic materials, metal materials, and evolution to  ceramic materials . As we all know, ceramic materials have many advantages compared to traditional substrate materials: 1. Low communication loss – The dielectric constant of the ceramic material itself makes the signal loss smaller. 2. High thermal conductivity – the heat on the chip...

    PBN-PG-Heater-Element High purity and high-performance  pyrolytic boron nitride  are used as the substrate for the PBN heating element. Pyrolytic graphite (PG) is placed on the surface of PBN plates by the CVD method as a conductor and heater. As both PG and PBN are extremely pure and very stable in a vacuum or inert atmosphere, the PBN-PG heating element could be very durable and keep the chamber clean. It could be heated to 1600°C in a very short time without the emission of any gas component. These heating elements are ideal products for the semiconductor industry and applications that require high temperature, high vacuum, and high purity. PBN/PG Composite Heating Elements Specifications Size 1″-4″ Bulk Density 2.15-2.19 g/cm3 Max. Working Temperature 2400°C Volume Resistivity (Ω·cm) 3.11*1011 Flexural Strength (Mpa) 243.63 Thermal Conductivity (W/M·k) 43.7-60 Dielectric Strength (at room temperature) KV/mm 56

Innovacera supplies precision   metallized ceramic components  in aluminum oxide ceramics for the military, medical, and aerospace industries. Through spray, needle, and brush coatings or screen printing our capabilities allow us to metallized on flat, cylindrical, and complex ceramic bodies. Moly-Manganese is the typical base coat materials used for metallization. Metallized Ceramics Applications: Ceramic Feed-through insulators, Ceramic Headers, Ceramic High-power receptacles, Ceramic Insulating discs, Ceramic Insulator rings and cylinders, Ceramic Precipitator products, Ceramic Power switches, Ceramic Traveling wave tubes, Ceramic Vacuum interrupters, Ceramic components for Windows, Ceramic Power grid tubes, X-ray Ceramic tubes Metallized Ceramics Joining types: Ceramic + Mo/Mn Metallized + plating Ni Ceramic + Mo/Mn Metallized + plating Ag Ceramic + Mo/Mn Metallized + plating Au Ceramic + printing Ag Special types are available according to customer’s drawin...

Innovacera manufactures standard and customized vacuum multipin feedthrough, here are some standard product: Circular Type Multipin Vacuum Feedthrough 1500V / 5A CF35 Flange with 41 pins. Circular Type Multipin Vacuum Feedthrough KF25 Flange with 16 pins or 19 pins. Circular Type Multipin Vacuum Feedthrough KF40 Flange with 16 pins or 19 pins. Different flange and quantity of conductor pin are available and pin sizes can be customized with different electric current. Technology Data: Flange Type: CF35 Installation: Weldable Pin number: 41Pin Electric current: 5A Withstand voltage: 1500V Insulation: 1000MΩ Temperature: （-100℃~+200℃） Pressure: 5MPa Leakage rate: <1*109Pa·m/s Material: SUS304 Vacuum Application: UHV

Powder metallurgy has core process advantages such as high material utilization, low unit energy consumption, and environmental protection. It is a technology that is in line with the future direction of carbon neutrality. In recent years, with the maturity of powder metallurgy technology and the trend of miniaturization of parts, two emerging process routes, metal injection molding (MIM) and 3D printing (AM), have rapidly emerged.   At the same time, the supply of high-quality powder raw materials has begun to become a major factor restricting the development of the industry.   Small and complex parts are undoubtedly more suitable for injection molding and 3D printing (particle size of 20μm or even smaller), and have been increasingly used in high-end fields such as aerospace, medical, electronics, and military industry.   Therefore, the preparation of metal powders with high purity, good sphericity, small particle size and narrow distribution, and low oxygen content has...