INNOVACERA | technical ceramic solutions

  In the modern electronics industry, the three types of ceramic packaging and component technologies, namely HTCC, LTCC and MLCC, jointly form the foundation of high-performance electronic systems.   Although they all belong to the multi-layer ceramic technology system, their application directions and performance emphases are different:  HTCC is used for high-reliability and high-power packaging, LTCC excels in integrating high-frequency and multi-functional circuits, and MLCC is the core type of surface-mount passive components.  These three factors jointly support the high performance and miniaturization development of modern electronic devices.  This article mainly introduces the HTCC packaging technology:     HTCC packaging combines alumina or aluminum nitride porcelain wafers with tungsten/molybdenum metal circuits through a set of precision ceramic-metal co-firing process, and finally forms a high-density, highly reliable three-dimensional cera...

  1. MgO-ZrO2 Ceramic Metering Nozzles (lnserts) They are mainly used in steel making continuous casting ladles, converter tundishes, and converter taphole slag retaining mechanisms. Features: Good erosion resistance, corrosion resistance Thermal shock stability The service time is generally 50 hours, which solves problems such as clogging, cracking and diameter expansion. Related general products: Continuous casting tundish upper nozzle Tundish quick change nozzle Fixed diameter nozzle for continuous casting. 2. MgO-ZrO2 Ceramic Atomizing Nozzles They are mainly used in the powder metallurgy industry, the smelting of ferrous and non-ferrous metal powders, such as nickel-based alloy powders, copper powders, stainless steel powders, iron powders and other super alloy powders. Features: Higher density, Excellent resistance to high temperature corrosion, Resistance to erosion by metallic liquids Thermal shock performance. Different stabilizer materials and particle sizes are used acc...

Innovacera’s  Aluminum Nitride (AlN)  Substrates deliver exceptional thermal conductivity, a thermal expansion coefficient closely matched to silicon, and excellent electrical insulation, making them an ideal choice for high-power electronic applications. With superior mechanical strength, high breakdown voltage, and outstanding thermal shock resistance, AlN substrates ensure reliable performance in demanding environments. Their precision machining capability and customizable specifications make them well-suited for IGBT power modules, high-power LEDs, and advanced heat dissipation components.   Features • High thermal conductivity • Thermal expansion coefficient close to silicon wafer • High breakdown voltage Application • High power IGBT power module • High-power LED • High power heat sink Material Properties Table P roject Test conditions Unit AlN AN-170 AN-200 AN-230 Material – – AlN AlN AlN Appearance – – Light blue beige beige Surface roughness Ra μ m 0.2~0.75 0.2~0...